이 특허를 인용한 특허 (56)

1. Jeon, Byeong Hwan; Park, Kyoung Soo; Kim, Bong Yong; Kwon, Young Jin; Yoon, Kang Bae; Shin, Kyong Hun; Namkung, Hyun Hee; Seo, Hyun Joo; Lee, Cheon Seok, Adhesive composition and anisotropic conductive film using the same.

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2. Okada, Kenichi; Takahashi, Toshitaka; Kanamaru, Mika; Umeda, Michio, Adhesive composition, adhesive optical film and image display device.

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3. Okada, Kenichi; Takahashi, Toshitaka; Kanamaru, Mika; Umeda, Michio, Adhesive composition, adhesive optical film and image display device.

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4. Bluem Gregory L. ; Haak Christopher A. ; McCormick ; Jr. Fred B. ; Tead Stanley F., Adhesive compositions and methods of use.

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5. Kanamaru, Mika; Okada, Kenichi; Takahashi, Toshitaka, Adhesive film and image display device.

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6. Haak Christopher A. (Oakdale MN) Kropp Michael A. (Cottage Grove MN) Bennett Greggory S. (Ratinger DEX), Adhesives containing electrically conductive agents.

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7. Haak Christopher A. ; Kropp Michael A. ; Bennett Greggory S.,DEX, Adhesives containing electrically conductive agents.

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8. Sakurai Ryo,JPX ; Matsuse Takahiro,JPX ; Kotsubo Hidefumi,JPX ; Kitano Tetsuo,JPX ; Morimura Yasuhiro,JPX, Anisotropic conductive film.

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9. Zhan,Guodong; Kuntz,Joshua D.; Mukherjee,Amiya K., Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes.

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10. Sakurai Ryou,JPX ; Saito Tasuku,JPX ; Kotsubo Hidefumi,JPX, Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particle.

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11. Loh Karl I. (E. Hanover NJ) Lee Chang Hoon (Kyungki-Do KRX), Apparatus including a peak shaped dielectric dam.

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12. Malloy, Allen L.; Rodrigues, Julio F., Cable connector having a biasing element.

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13. Rodrigues, Julio F.; Mango, Jr., Joey D.; Phillips, Jr., Roger, Cable connector with biasing element.

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14. Tang Pao-Yun,TWX ; Chang Shyh-Ming,TWX ; Lee Yu-Chi,TWX ; Fang Su-Yu,TWX, Composite bump tape automated bonded structure.

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15. Tsukagoshi Isao (Shimodate) Yamaguchi Yutaka (Yuki) Nakajima Atsuo (Ibaraki) Goto Yasushi (Shimodate JPX), Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips.

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16. Montena, Noah; Krenceski, Mary, Conductive elastomer and method of applying a conductive coating to a cable.

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17. Krenceski, Mary, Conductive elastomer and method of applying a conductive coating to elastomeric substrate.

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18. Tsukakoshi Kenji,JPX ; Akita Shuichi,JPX ; Goto Kuniaki,JPX, Conductive elastomer film, method for production thereof, and conductive elastomer composition.

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19. Crotzer David R. ; Michaud Arthur G. ; Silva Neil N., Conductive elastomer for grafting to an elastic substrate.

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20. Crotzer David R. ; Hanrahan Mark G. ; Silva Neill N., Conductive elastomer for grafting to thermoplastic and thermoset substrates.

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21. Crotzer David R. ; Goodwin Jonathan W. ; Michaud Arthur G. ; DeDonato David A., Conductive elastomers and methods for fabricating the same.

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22. Lua, Edmund Koon Tian; Leng, Nam Yin, Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same.

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23. Chang Shyh-Ming (Hsinchu TWX) Lee Yu-Chi (Taipei Hsien TWX) Tang Pao-Yun (Hsinchu TWX), Connection construction and method of manufacturing the same.

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24. Krenceski, Mary; Mathews, Roger; Montena, Noah, Connector having a conductively coated member and method of use thereof.

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25. Krenceski, Mary; Mathews, Roger; Montena, Noah, Connector having a conductively coated member and method of use thereof.

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26. Krenceski, Mary; Mathews, Roger; Montena, Noah, Connector having a conductively coated member and method of use thereof.

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27. Krenceski, Mary; Mathews, Roger; Montena, Noah P., Connector having a grounding member.

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28. Strange Andrew, Elastomeric shielded connector.

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29. Calhoun Clyde D. (St. Paul MN) Koskenmaki David C. (St. Paul MN), Electrical connector tape.

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30. Choi, Jeongwan; Sa, Un Nyoung; Kim, Won-Sik, Electrically conductive polymer resin and method for making same.

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31. Choi, Jeongwan; Sa, Un Nyoung; Kim, Won-Sik, Electrically conductive polymer resin and method for making same.

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32. Heumann William L. (Crestwood KY), Fluidized bed wtih cyclone.

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33. Van den Bossche,Linda Maria Gisele Roberta; Lewtas,Kenneth; Luvinh,Quoc, Heat sealable compositions and uses thereof.

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34. Kristiansen, Helge; Redford, Keith; Helland, Tore, Isotropic conductive adhesive.

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35. Lung,Hsing Chj; Wen,Chun Bin; Tseng,Hung I; Wei,Chung Kuang, Liquid crystal display device and method of manufacturing the same wherein the substrate having particular surface roughness.

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36. Nishida,Kazuto, Method and device for mounting electronic component on circuit board.

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37. Yamada Yukio,JPX ; Saito Masao,JPX ; Shinozaki Junji,JPX ; Takeichi Motohide,JPX, Multilayer anisotropic electroconductive adhesive and method for manufacturing same.

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38. Sammakia, Bahgat; Jones, Jr., Wayne E.; Subbarayan, Ganesh, Nano-structure enhancements for anisotropic conductive material and thermal interposers.

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39. Yanai, Hiroaki; Hashizume, Toshiaki, Optical device and method for manufacturing optical device.

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40. Mikura Chiemi,JPX ; Yamaoka Takashi,JPX ; Wakabayashi Akira,JPX, Optical film and liquid crystal display.

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41. Bejtlich Leonard M., Optical radiation conducting zones and associated bonding and alignment systems.

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42. Yamamoto, Yasutaka; Tanabe, Koji, Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same.

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43. Yarusso David J. ; Hyde Patrick D., Pressure-sensitive adhesive based on partially oriented and partially crystallized elastomer.

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44. Yarusso David J. ; Hyde Patrick D., Pressure-sensitive adhesive based on partially oriented and partially crystallized elastomer.

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45. Jameson Lee K. (Roswell GA) Cohen Bernard (Berkley Lake GA), Process for hydrosonically microaperturing.

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46. Wolk Martin B. (Woodbury MN) Isberg Thomas A. (Apple Valley MN) Kropp Michael A. (Cottage Grove MN) Dower William V. (St. Paul MN) Gerber Joel A. (St. Paul MN), Process for making a Z-axis adhesive and establishing electrical interconnection therewith.

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47. Vanderstappen,Hugo; Van Den Bossche,Linda Maria Gisele Roberta; Lewtas,Kenneth, Protective films.

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48. Chun Heung Sup,KRX, Semiconductor apparatus having a leadframe with coated leads.

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49. Chun Heung Sup,KRX, Semiconductor bonding package.

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50. Akhter Sohail, Static dissipative label.

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51. Tang Pao-Yun,TWX, Tape automated bonding method.

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52. Tang Pao-Yun,TWX, Tape automated bonding method and bonded structure.

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53. Imahori Yoshio,JPX ; Suzuki Kazushi,JPX ; Tajima Kazushige,JPX, Terminal connection method of a coil and terminal connection structure of a coil.

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54. Kim Jin Sung,KRX, UFBGA package equipped with interface assembly including a photosoluble layer.

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55. Li, Weijin, UV curable and electrically conductive adhesive for bonding magnetic disk drive components.

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56. Li, Weijin, UV curable and electrically conductive adhesive for bonding magnetic disk drive components.

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