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Laser processing method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
출원번호 US-0897830 (1986-08-19)
우선권정보 JP-0182573 (1985-08-20)
발명자 / 주소
  • Imamura Seiji (Kanagawa JPX) Matsumoto Noriaki (Kanagawa JPX)
출원인 / 주소
  • Fuji Electric Corporate Research & Development Ltd. (Kanagawa JPX 03)
인용정보 피인용 횟수 : 114  인용 특허 : 0

초록

A laser processing method comprises the steps of generating a pulsed laser beam having a substantially circular shape; modifying the beam to a substantially rectangular shape; and scribing the surface of a workpiece with the rectangular beam to form grooves therein. The scribing step may include sca

대표청구항

A laser processing method for scribing the surface of a workpiece, said method comprising: generating a laser beam; modifying said beam to have a substantially rectangular shape; and scribing said surface of said workpiece with said rectangular beam to form a groove in said surface, said scribing st

이 특허를 인용한 특허 (114)

  1. Zhang, Hongyong; Yamazaki, Shunpei; Takemura, Yasuhiko, Active matrix display device.
  2. Yamazaki Shunpei,JPX ; Kusumoto Naoto,JPX ; Tanaka Koichiro,JPX, Active matrix display device with TFTs of different refractive index.
  3. Scaggs, Michael J., Apparatus for scribing thin films in photovoltaic cells.
  4. Scaggs, Michael J., Apparatus for scribing thin films in photovoltaic cells.
  5. Tanaka, Koichiro, Beam homogenizer, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device.
  6. Tatah Adbelkrim, Fan-out beams for repairing an open defect.
  7. Lizotte, Todd E; Ohar, Orest, Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications.
  8. Lizotte, Todd E.; Ohar, Orest, Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming or milling applications.
  9. Kelley James George (California KY) Rockstroh Todd Jay (Maineville OH), Gas turbine engine component with compound cooling holes and method for making the same.
  10. Tatah Abdelkrim (Arlington MA), Laser ablation forward metal deposition with electrostatic assisted bonding.
  11. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser beam machining method.
  12. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser beam machining method.
  13. Oba, Ryugo; Morikazu, Hiroshi, Laser beam processing machine.
  14. Tanaka, Koichiro, Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device.
  15. Tanaka, Koichiro, Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device.
  16. Tanaka, Koichiro, Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device.
  17. Tanaka, Koichiro, Laser irradiation apparatus.
  18. Tanaka, Koichiro, Laser irradiation apparatus.
  19. Tanaka, Koichiro, Laser irradiation apparatus.
  20. Tanaka,Koichiro, Laser irradiation apparatus.
  21. Tanaka, Koichiro; Yamamoto, Yoshiaki, Laser irradiation apparatus and method for manufacturing semiconductor device.
  22. Tanaka, Koichiro; Yamamoto, Yoshiaki, Laser irradiation method and laser irradiation apparatus.
  23. Tanaka, Koichiro; Miyairi, Hidekazu; Shiga, Aiko; Shimomura, Akihisa; Isobe, Atsuo, Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device.
  24. Tanaka, Koichiro; Miyairi, Hidekazu; Shiga, Aiko; Shimomura, Akihisa; Isobe, Atsuo, Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device.
  25. Tanaka,Koichiro; Miyairi,Hidekazu; Shiga,Aiko; Shimomura,Akihisa; Isobe,Atsuo, Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device.
  26. Tanaka, Koichiro; Yamamoto, Yoshiaki, Laser irradiation method, laser irradiation apparatus, and method for fabricating semiconductor device.
  27. Gögler, Michael, Laser microdissection method and laser microdissection device.
  28. Ishihara Hiroaki,JPX ; Nakashita Kazuhisa,JPX ; Ohnuma Hideto,JPX ; Tanaka Nobuhiro,JPX ; Adachi Hiroki,JPX, Laser processing apparatus and laser processing process.
  29. Ishihara, Hiroaki; Nakashita, Kazuhisa; Ohnuma, Hideto; Tanaka, Nobuhiro; Adachi, Hiroki, Laser processing apparatus and laser processing process.
  30. Ohnuma, Hideto; Tanaka, Nobuhiro; Adachi, Hiroki, Laser processing apparatus and laser processing process.
  31. Ohnuma,Hideto; Tanaka,Nobuhiro; Adachi,Hiroki, Laser processing apparatus and laser processing process.
  32. Ken Muneyuki JP; Kenji Kasai JP; Izuru Nakai JP; Haruhiro Yuki JP, Laser processing apparatus and method.
  33. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki, Laser processing method.
  34. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  35. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  36. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  37. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  38. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  39. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  40. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  41. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  42. Hughes John L. (Melbourne AUX) Lastavec Paul (Narooma AUX), Laser sawmill.
  43. Troitski, Igor, Laser-dynamic system for using in games.
  44. Tanaka,Koichiro, Manufacturing method of semiconductor device.
  45. Tatah Abdelkrim ; Ishizuka Makoto, Mechanically restricted laser deposition.
  46. Yahagi Susumu (Yokohama JPX), Method and apparatus for joining together associated metal conductors of a layer structure with an insulating layer prov.
  47. Tanaka,Koichiro, Method and apparatus for laser irradiation and manufacturing method of semiconductor device.
  48. Kinoshita Makoto,JPX ; Kobayashi Takeshi,JPX, Method and apparatus for machining an electrically conductive film.
  49. Rekow, Matthew; Murison, Richard; Panarello, Tullio; Dunsky, Corey, Method and apparatus for scribing a line in a thin film using a series of laser pulses.
  50. Sawai Hidekazu,JPX ; Kurosawa Miki,JPX ; Matsubara Masato,JPX, Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering.
  51. Vogt, Helmut; Karg, Franz, Method and device for thin-film ablation of a substrate.
  52. Patterson Daniel G. ; Kadar-Kallen Michael A., Method for creation of inclined microstructures using a scanned laser image.
  53. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method for cutting semiconductor substrate.
  54. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Method for dicing substrate.
  55. Grunewald, Philipp; Rumsby, Phil, Method for laser scribing of solar panels.
  56. Hidekazu Sawai JP; Miki Kurosawa JP; Masato Matsubara JP, Method for machining wiring board with laser beam and device for same.
  57. Kawazoe, Kohei; Uda, Kazutaka; Baba, Tomoyoshi; Ishide, Takashi; Nakao, Sachiko, Method for manufacturing photoelectric-conversion-device, device for photoelectric-conversion-device manufacturing device, and photoelectric conversion device.
  58. Aberle, Hanns-Dieter; Paganelli, Dino, Method for material machining by way of laser.
  59. Kusumoto Naoto,JPX ; Yamazaki Shunpei,JPX, Method for producing insulated gate thin film semiconductor device.
  60. Kusumoto Naoto,JPX ; Yamazaki Shunpei,JPX, Method for producing insulated gate thin film semiconductor device.
  61. Kusumoto, Naoto; Yamazaki, Shunpei, Method for producing insulated gate thin film semiconductor device.
  62. Kusumoto, Naoto; Yamazaki, Shunpei, Method for producing insulated gate thin film semiconductor device.
  63. Kusumoto, Naoto; Yamazaki, Shunpei, Method for producing insulated gate thin film semiconductor device.
  64. Kusumoto,Naoto; Yamazaki,Shunpei, Method for producing insulated gate thin film semiconductor device.
  65. Modena, Mario; Donadon, Antonio Ruggero Sante, Method for production of safety/rupture discs.
  66. Shunpei Yamazaki JP, Method of crystallizing a semiconductor layer in a MIS transistor.
  67. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate and method of manufacturing a semiconductor device.
  68. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device.
  69. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device.
  70. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
  71. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
  72. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting object to be processed.
  73. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
  74. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
  75. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion.
  76. Yamazaki, Shunpei, Method of fabricating a MIS transistor.
  77. Yamazaki,Shunpei, Method of fabricating a MIS transistor.
  78. Ichikawa Tadashi,JPX ; Ito Hiroshi,JPX, Method of forming groove by laser.
  79. Balamane Hamid ; Poon Chie Ching ; Robertson Neil Leslie ; Tam Andrew Ching, Method of laser cutting a metal line on an MR head.
  80. Balamane Hamid ; Poon Chie Ching ; Robertson Neil Leslie ; Tam Andrew Ching, Method of laser cutting a metal line on an MR head with a laser.
  81. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of manufacturing a semiconductor device formed using a substrate cutting method.
  82. Yamazaki Shunpei,JPX ; Kusumoto Naoto,JPX ; Tanaka Koichiro,JPX, Method of producing a semiconductor device with overlapped scanned linear lasers.
  83. Starkston, Robert; Proctor, Andrew; Terry, Steve, Methods and apparatus for laser scribing wafers.
  84. Beinglass, Israel, Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing.
  85. Ito, Yusaku, Optical device and laser beam machining apparatus having optical device.
  86. Nishimiya, Tatsuyuki; Uda, Kazutaka; Kawazoe, Kohei; Baba, Tomoyoshi; Ishide, Takashi, Photoelectric conversion device fabrication method and photoelectric conversion device.
  87. Marshall Gordon Jones, Photomultiplier tube reprocessing.
  88. Hongyong Zhang JP; Shunpei Yamazaki JP; Yasuhiko Takemura JP, Process for laser processing and apparatus for use in the same.
  89. Zhang, Hongyong; Yamazaki, Shunpei; Takemura, Yasuhiko, Process for laser processing and apparatus for use in the same.
  90. Zhang,Hongyong; Yamazaki,Shunpei; Takemura,Yasuhiko, Process for laser processing and apparatus for use in the same.
  91. Tatah Abdelkrim, Repair of dielectric-coated electrode or circuit defects.
  92. Tatah Abdelkrim, Repair of metal lines by electrostatically assisted laser ablative deposition.
  93. Angeley, David G.; Andersen, Dan E.; James, Philip S., Scanner laser handpiece with shaped output beam.
  94. Angeley,David G.; Andersen,Dan E.; James,Philip S., Scanning laser handpiece with shaped output beam.
  95. German John D. ; Cramer Eric J. ; Tocci Michael D. ; Spielbusch Brian K. ; Saggese Steven J., Self-contained laser illuminator module.
  96. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Semiconductor chip manufacturing method.
  97. Tanaka, Koichiro; Isobe, Atsuo; Yamamoto, Yoshiaki, Semiconductor device and its manufacturing method.
  98. Yamazaki, Shunpei; Kusumoto, Naoto; Tanaka, Koichiro, Semiconductor device and method for producing the same.
  99. Yamazaki Shunpei,JPX ; Kusumoto Naoto,JPX ; Tanaka Koichiro,JPX, Semiconductor device having channel refractive index in first and second directions.
  100. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  101. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  102. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  103. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  104. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  105. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  106. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  107. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  108. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  109. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  110. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  111. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  112. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  113. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  114. Andersen,Dan E.; Angeley,David G.; Wiltberger,Michael W., System, method and apparatus for providing uniform illumination.
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