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Temperature control for device under test 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01K-017/00
출원번호 US-0728860 (1985-04-30)
발명자 / 주소
  • Eager George (Cambridge MA) Selverstone Pater (Cambridge MA)
출원인 / 주소
  • Temptronic Corporation (Newton MA 02)
인용정보 피인용 횟수 : 94  인용 특허 : 0

초록

A system for and method of precisely controlling the temperature of an electronic component through a range of temperatures by controlling the temperature of a gas forced into contact with the component is disclosed. The system comprises a dual control loop including two sensors, one for measuring t

대표청구항

In a system for precisely controlling the temperature of a substantially solid object through a range of temperatures, said system including (a) support means for supporting said object; (b) means, responsive to a control signal, for contorlling the temperature of a fluid; (c) means for directing sa

이 특허를 인용한 특허 (94)

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  13. Dunklee,John, Chuck for holding a device under test.
  14. Dunklee,John, Chuck for holding a device under test.
  15. Dunklee,John, Chuck for holding a device under test.
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  17. Stewart,Craig; Lord,Anthony; Spencer,Jeff; Burcham,Terry; McCann,Peter; Jones,Rod; Dunklee,John; Lesher,Tim; Newton,David, Chuck for holding a device under test.
  18. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  19. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  20. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
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  33. Robert T. Stewart, Method and apparatus for optimizing environmental temperature for a device under test.
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  35. Pelissier, Jean Luc, Method and apparatus for temperature control of a device during testing.
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  37. Rennies Jos,BEX ; Noels Barts,BEX, Method and apparatus for temperature-controlled testing of integrated circuits.
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  39. Stone,William M.; Lopez,Robert, Method of manufacturing a workpiece chuck.
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  42. Harris,Daniel L.; McCann,Peter R., Optical testing device.
  43. Rignall Michael W. (Dursley GB3), Oven for the burn-in of integrated circuits.
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  45. Kinsley, Tom, Power sink for IC temperature control.
  46. Nordgren, Greg; Dunklee, John, Probe station.
  47. Nordgren, Greg; Dunklee, John, Probe station.
  48. Schwindt Randy (Portland OR), Probe station having conductive coating added to thermal chuck insulator.
  49. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  50. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
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  52. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  53. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  54. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
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  89. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
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