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Method of connecting a semiconductor device to a wiring board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-031/00
출원번호 US-0943197 (1986-12-18)
발명자 / 주소
  • Hatada Kenzo (Katano JPX)
출원인 / 주소
  • Matsushita Electric Industrial Co., Ltd. (Osaka JPX 03)
인용정보 피인용 횟수 : 51  인용 특허 : 0

초록 ▼

Method of connecting a semiconductor device to a wiring board in which electrical connection of metal bumps of a semiconductor device and wiring pattern of a wiring board is accomplished by pressure application between the bumps and wiring pattern, and mechanical fixing of the semiconductor device o

대표청구항 ▼

A method of connecting a semiconductor device to a wiring board comprising: providing a wiring board with a wiring pattern and a semiconductor device with metal bumps; disposing hardenable insulating resin which is stiffened by application of at least one of light and heat between said metal bumps a

이 특허를 인용한 특허 (51)

  1. MacKay Colin A. (Austin TX), Bonding electrical leads to pads on electrical components.
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  2. Go Tiong C. (El Toro CA), Bonding of aligned conductive bumps on adjacent surfaces.
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  3. Chen, Yu; Gerber, Joel A.; Schreiber, Brian E.; Smith, Joshua W., Circuit elements using z-axis interconnect.
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  4. Uchiyama, Kenji, Component mounting method and method of producing electro-optical device.
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  5. Shyh-Ming Chang TW; Jwo-huei Jou TW; Yu-Chi Lee TW; Dyi-Chung Hu TW, Composite bump bonding.
    상세보기
  6. Chang Shyh-Ming,TWX ; Lee Yu-Chi,TWX ; Jou Jwo-Huei,TWX, Composite bump structures.
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  7. Chang, Shyh-Ming; Yang, Sheng-Shu; An, Chao-Chyun, Contact structure having a compliant bump and a testing area.
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  8. Akram, Salman; Farnworth, Warren M.; Wood, Alan G.; Brooks, J. Michael; Cloud, Eugene H., Electrical device allowing for increased device densities.
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  9. Akram, Salman; Farnworth, Warren M.; Wood, Alan G.; Brooks, J. Michael; Cloud, Eugene H., Electrical device allowing for increased device densities.
    상세보기
  10. Akram, Salman; Farnworth, Warren M.; Wood, Alan G.; Brooks, J. Michael; Cloud, Eugene H., Electrical device allowing for increased device densities.
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  11. Wada, Yoshiyuki; Sakai, Tadahiko, Electronic component mounting method and electronic component mounting device.
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  12. Ghoshal Ramkrishna ; Mukerji Prosanto, Epoxy resin composition with cycloaliphatic epoxy-functional siloxane.
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  13. Aschenbrenner Rolf,DEX ; Gwiasda Jorg,DEX ; Zakel Elke,DEX ; Eldring Joachim, Flip chip bonding with non conductive adhesive.
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  14. Estes Richard H. ; Ito Koji,JPX ; Akita Masanori,JPX ; Mori Toshihiro,JPX, Flip chip mounting technique.
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  15. Estes Richard H. ; Ito Koji,JPX ; Akita Masanori,JPX ; Mori Toshihiro,JPX ; Wada Minoru,JPX, Flip chip mounting technique.
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  16. Richard H. Estes ; James E. Clayton ; Koji Ito JP; Masanori Akita JP; Toshihiro Mori JP; Minoru Wada JP, Flip chip mounting technique.
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  17. Carey David H. (Austin TX), Flip substrate for chip mount.
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  18. Flynn James T. (Fairport NY) Ng Yee S. (Fairport NY), LED printer.
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  19. Chris M. Schreiber, Metallic microstructure springs and method of making same.
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  20. Fujimoto Hiroaki (Hirakata JPX) Hatada Kenzou (Katano JPX) Takeshita Yoshinobu (Kagoshima JPX) Otani Kazuya (Kagoshima JPX) Hidaka Koji (Kushikino JPX) Sakiyama Tsuguo (Kagoshima JPX), Method for attaching semiconductors to a transparent substrate using a light-curable resin.
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  21. Chino Toyoji,JPX ; Yoshida Takayuki,JPX ; Matsuda Kenichi,JPX, Method for fabricating semiconductor device.
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  22. Toyoji Chino JP; Takayuki Yoshida JP; Kenichi Matsuda JP, Method for fabricating semiconductor device.
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  23. Iovdalsky Viktor Anatolievich,RUX, Method for fitting a semiconductor chip.
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  24. Repp, R. Scott; Stallman, Pamela M., Method for making an articulatable vehicular window assembly.
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  25. Chen Yu ; Gerber Joel A. ; Schreiber Brian E. ; Smith Joshua W., Method for making circuit elements for a z-axis interconnect.
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  26. Lewno, Jeffrey A., Method for manufacturing an articulatable vehicular window assembly.
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  27. Fukunaga, Akira; Nagasawa, Hiroshi, Method for mounting semiconductor device.
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  28. Akira Takashima JP; Mitsutaka Sato JP; Shinichirou Taniguchi JP, Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom.
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  29. Hatada Kenzo (Katano JPX) Fujimoto Hiroaki (Hirakata JPX), Method of connecting electrodes.
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  30. Kaneda Yukihiro,JPX ; Takizawa Shuichi,JPX, Method of grinding semiconductor articles.
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  31. Ryoichi Morimoto,JPX, Method of mounting a piezoelectric element.
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  32. Watanabe Makoto,JPX, Mounting method of semiconductor chip.
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  33. Charles,Scott B.; Gross,Kathleen M.; Hackett,Steven C.; Kropp,Michael A.; Schultz,William J.; Thompson,Wendy L., Nanoparticle filled underfill.
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  34. Charles,Scott B.; Gross,Kathleen M.; Hackett,Steven C.; Kropp,Michael A.; Schultz,William J.; Thompson,Wendy L., Nanoparticle filled underfill.
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  35. Contois Lawrence E. (Webster NY) Ng Yee S. (Fairport NY) Zeise Eric K. (Pittsford NY), Non-impact printhead using a mask with a dye sensitive to and adjusted by light in a first spectrum to balance the trans.
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  36. Treliant Fang ; Melissa E. Grupen-Shemansky ; Shun-Meen Kuo, Nonconductive laminate for coupling substrates and method therefor.
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  37. Jairazbhoy Vivek Amir ; McMillan ; II Richard Keith ; Pao Yi-Hsin, Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips.
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  38. Sofia John W. (Wakefield MA) Hallowell David L. (Westford MA), Outer lead tape automated bonding system.
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  39. Tsukagoshi Isao,JPX ; Yamaguchi Yutaka,JPX ; Nakajima Atsuo,JPX ; Goto Yasushi,JPX, Process for connecting circuits and adhesive film used therefor.
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  40. Wolk Martin B. (Woodbury MN) Isberg Thomas A. (Apple Valley MN) Kropp Michael A. (Cottage Grove MN) Dower William V. (St. Paul MN) Gerber Joel A. (St. Paul MN), Process for making a Z-axis adhesive and establishing electrical interconnection therewith.
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  41. Hashimoto, Nobuaki, Semiconductor device and method of manufacture thereof, circuit board and electronic instrument.
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  42. Hasimoto,Nobuaki, Semiconductor device and method of manufacture thereof, circuit board and electronic instrument.
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  43. Hashimoto,Nobuaki, Semiconductor device, circuit board and electronic instrument that include an adhesive with conductive particles therein.
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  44. Hashimoto, Nobuaki, Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment.
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  45. Nobuaki Hashimoto JP, Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment.
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  46. Dotsenko, Vladimir V., Superconductive multi-chip module for high speed digital circuits.
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  47. Kwon,Soon Bog; Lee,Sang Hun; Moon,Yang Sik; Hong,Ki Pyo; Cho,Yoon Kuen, Tape substrate and method for fabricating the same.
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  48. Lewno, Jeffrey A., Vehicular rear sliding window assembly.
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  49. Lewno, Jeffrey A., Vehicular sliding window assembly.
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  50. Repp, R. Scott; Stallman, Pamela M., Window assembly for vehicle.
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  51. Repp,R. Scott; Stallman,Pamela M, Window assembly suitable for use in a vehicle.
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