[특허]Hydraulic manifold for water cooling of multi-chip electric modules

Hydraulic manifold for water cooling of multi-chip electric modules 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0858135 (1986-04-30)
발명자 / 주소	Flint Ephraim B. (Garrison NY) Grebe Kurt R. (Beacon NY)
출원인 / 주소	International Business Machines Corp. (Armonk NY 02)
인용정보	피인용 횟수 : 22 인용 특허 : 0

초록 ▼

A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

대표청구항 ▼

A manifold for conducting coolant to a plurality of electric circuit chips having cooling devices connected thereto, the manifold comprising: a body having a first and a second coolant conduit means, said body including a first set of apertures communicating with said first conduit means and a second set of apertures communicating with said second conduit means; a first set and a second set of flexible hollow appendages connected to said body respectively at said first and said second sets of apertures and extending from said body for conduction of coolant between said cooling devices and said first and said second conduit means of said body, each of said appendages being distensible to allow connection with ports of said cooling devices; and wherein said first conduit means and said second conduit means are separate from each other for maintaining separate flows of the coolant to and from each of said cooling device; said body further comprising a plurality of sections extending transversely of said appendages and being arranged alongside one another to define said first and said second conduit means including fluid conduction passages therein, said first and said second sets of apertures being disposed in separate ones of said sections spaced apart from each other to permit connection of said first and said second sets of appendages independently of each other to their respective first and second sets of aperture ;and wherein a first one of said body sections and a second one of said body sections are secured together, said first conduit means being formed within said first section, and said first set of apertures being formed in said second section; two of said appendages are connectable with each of said cooling devices, one of said two appendages serving as an inlet coolant conduit and the second of said two appendages serving as an outlet coolant conduit; said two appendages are mounted coaxially of each other with one appendage being outside of and surrounding the other inner appendage, and wherein a third one of said body sections is secured to said second section and has said second set of apertures in registration with the apertures of said second section, the inner appendage of said two appendages connecting with an aperture of said second section and the outer appendage of said two appendages connecting with an aperture of said third section; and wherein said second section has sidewalls contacting said third section for spacing said first set of apertures away from said cooling devices at a distance greater than a spacing of said second set of apertures from said cooling devices, the inner one of said two appendages being longer than the outer one of said two appendages to extend said greater distance from said cooling devices to said first set of apertures, the differing lengths of inner and outer appendages facilitating connection of inner and outer appendages independently of each other to a cooling device.

이 특허를 인용한 특허 (22)

Straznicky, Ivan; Power Fardy, Richard Jude, Adjustable height liquid cooler in liquid flow through plate.
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Stuckey, Larry, Advanced thermal control interface.
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Taylor, Troy; Wetzel, Steve, Apparatus and method for controlling die force in a semiconductor device testing assembly.
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Wayburn,Lewis S.; Spearing,Ian G.; Schmidt, Jr.,Charles R., Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test.
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Paquette, Jeffrey; Cheyne, Scott R.; Ellsworth, Joseph R., Assembly to provide thermal cooling.
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Gardell David L. ; Gaspar Krisztian ; Morin Guy C., Co-axial bellows liquid heatsink for high power module test.
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Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
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Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
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Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
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Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Fabricating multi-component electronic module with integral coolant-cooling.
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Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
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Stevanovic,Ljubisa Dragoljub; Solovitz,Stephen Adam, Heat sink with microchannel cooling for power devices.
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Inui, Tsuyoshi; Kado, Hideo; Kawamoto, Yoshinobu, Heatsink and semiconductor device with heatsink.
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Valenzuela Javier A. (Grantham NH), High heat flux compact heat exchanger having a permeable heat transfer element.
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Matthew G. Kramer, Machinery cooling system.
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Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
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Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
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Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
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Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
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Koontz, Christopher R.; Chu, Charles; Vidaurri, Rosalio S., Semiconductor cooling apparatus.
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Rule, David D., Temperature regulating systems.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

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Hydraulic manifold for water cooling of multi-chip electric modules 원문보기

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Hydraulic manifold for water cooling of multi-chip electric modules 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (22)

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