이 특허를 인용한 특허 (41)

1. Tonti, William R.; Bertin, Claude L.; Kao, Albert Y.; Zalesinski, Jerzy M., Charge-coupled device wafer cover plate with compact interconnect wiring.

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2. Glenn, Thomas P.; Webster, Steven; Liebhard, Markus K., Chip size image sensor bumped package.

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3. Glenn, Thomas P.; Webster, Steven; Liebhard, Markus K., Chip size image sensor bumped package fabrication method.

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4. Glenn, Thomas P.; Webster, Steven; Liebhard, Markus K., Chip size image sensor wirebond package fabrication method.

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5. Yusa Masami,JPX ; Kato Toshihiko,JPX ; Inoue Fumio,JPX ; Ichimura Shigeki,JPX, Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them.

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6. Kierse, Oliver; Hynes, Eamon, Control aperture for an IR sensor.

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7. Waitl, Gunter; Brunner, Herbert, Diode housing.

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8. Waitl, Gunther; Brunner, Herbert, Diode housing.

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9. Waitl,Gunther; Brunner,Herbert, Diode housing.

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10. Waitl,Gunther; Brunner,Herbert, Diode housing.

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11. Waitl,Gunther; Brunner,Herbert, Diode housing.

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12. Hingorany Prem R. (Broomfield CO), Explosively formed electronic packages.

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13. Mostafazadeh,Shahram; Smith,Joseph O.; Penry,Matthew D., Flip chip optical semiconductor on a PCB.

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14. Cole, Barrett E., Infrared detector packaged with improved antireflection element.

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15. Cole, Barrett E., Infrared detector packaged with improved antireflection element.

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16. Boyle John J. ; Robbins William L., Intergrated circuit die assembly.

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17. Waldman,Jaime I.; Ciminelli,Mario J.; Marcus,Michael A., Large area flat image sensor assembly.

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18. Shiraishi, Akinori, Light transmissive cover, device provided with same and methods for manufacturing them.

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19. Shiraishi,Akinori, Light transmissive cover, device provided with same and methods for manufacturing them.

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20. Philbrick Robert H. ; Ciccarelli Antonio S., Linear image sensor package assembly.

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21. Boyle John J. ; Robbins William L., Method for attaching a die to a carrier utilizing an electrically nonconductive layer.

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22. Peterson, Kenneth A.; Watson, Robert D., Method of fabricating a microelectronic device package with an integral window.

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23. Prior,Christophe, Method of fabricating an optical semiconductor package and optical semiconductor box.

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24. Hashimoto Nobuaki,JPX, Method of mounting a sealed assembly on a mounting substrate and optical transducer.

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25. Kenneth A. Peterson ; Robert D. Watson, Microelectronic device package with an integral window.

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26. Glenn Thomas P., Mounting for a semiconductor integrated circuit device.

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27. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.

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28. Peng, Goh Han; Yuan, Phang Kah; Alicaya, De Mesa Eduardo, Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating.

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29. Camacho, Zigmund R.; Bathan, Henry D.; Tay, Lionel Chien Hui; Trasporto, Arnel Senosa, Optical semiconductor device having pre-molded leadframe with window and method therefor.

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30. Camacho, Zigmund R.; Bathan, Henry D.; Tay, Lionel Chien Hui; Trasporto, Arnel Senosa, Optical semiconductor device having pre-molded leadframe with window and method therefor.

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31. Camacho, Zigmund R; Bathan, Henry D; Tay, Lionel Chien Hui; Trasporto, Amel Senosa, Optical semiconductor device having pre-molded leadframe with window and method therefor.

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32. Hou, Hao-Cheng; Chen, Yu-Feng; Cheng, Jung Wei; Liang, Yu-Min; Wang, Tsung-Ding, Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices.

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33. Hou, Hao-Cheng; Chen, Yu-Feng; Cheng, Jung Wei; Liang, Yu-Min; Wang, Tsung-Ding, Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices.

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34. Ogusu, Makoto, Photo detector unit and exposure apparatus having the same.

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35. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Pre-drilled image sensor package fabrication method.

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36. Lee,Jong Ung; Sin,Wha Su; Jeon,Jong Keun, Semiconductor package with improved chip attachment and manufacturing method thereof.

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37. You Joong Ha,KRX, Semiconductor package with transparent window and fabrication method thereof.

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38. Takagi, Yuichi; Kanazawa, Masayoshi; Ueda, Kazuhiko; Tsuchimochi, Makoto; Ikeda, Shigeo, Solid-state imaging apparatus and camera using the same.

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39. Takagi, Yuichi; Kanazawa, Masayoshi; Ueda, Kazuhiko; Tsuchimochi, Makoto; Ikeda, Shigeo, Solid-state imaging apparatus and camera using the same.

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40. Thomas P. Glenn, Surface acoustical wave flip chip.

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41. Jeanice Glenn; Di Caprio, Vincent; Webster, Steven; Glenn, Thomas P., Thin integrated circuit package having an optically transparent window.

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