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Surface mounted array strain relief device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/18
출원번호 US-0934297 (1986-11-24)
발명자 / 주소
  • Simpson John P. (Apalachin NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 54  인용 특허 : 0

초록 ▼

An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conduct

대표청구항 ▼

An electrical assembly comprising: (a) a printed circuit board having at least one major surface having predetermined locations thereon which are adapted to receive electrical conductors; (b) a substantially planar integrated circuit package having a plurality of electrical conductors fixed thereto

이 특허를 인용한 특허 (54)

  1. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Chip-scale carrier for semiconductor devices including mounted spring contacts.
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  2. Fjelstad Joseph, Compliant wirebond packages having wire loop.
    상세보기
  3. Gunsei Kimoto JP, Contact and contact assembly using the same.
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  4. Khandros,Igor Y., Contact structures and methods for making same.
    상세보기
  5. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.
    상세보기
  6. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.
    상세보기
  7. Barlow Alan (Cheltenham GB2), Electrical components and assemblies.
    상세보기
  8. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals.
    상세보기
  9. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
    상세보기
  10. Goldmann, Lewis S.; Prasad, Chandrika, Full wafer test configuration using memory metals.
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  11. Kman Stephen Joseph ; Stubecki John Arthur ; Sondej William Richard, Hammer for forming bulges in an array of compliant pin blanks.
    상세보기
  12. VanHouten, Dennis J.; Kring, Christopher S.; Sapak, Ben; Johnson, Jack L., Headliner with integral wire harness.
    상세보기
  13. Donner Edward O. (Poughkeepsie NY) Zumbrunnen Michael L. (Rochester MN), High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE).
    상세보기
  14. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.
    상세보기
  15. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Interposer, socket and assembly for socketing an electronic component and method of making and using same.
    상세보기
  16. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method and apparatus for burning-in semiconductor devices in wafer form.
    상세보기
  17. Khandros Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
    상세보기
  18. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
    상세보기
  19. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
    상세보기
  20. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of fabricating an interconnection element.
    상세보기
  21. Busacco Raymond A. (Lake Ariel PA) Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Molla Jaynal A. (Endicott NY) Saxenmeyer ; Jr. George J. (Apalachin NY) Topa Robert D. (Binghamton NY), Method of forming a conductive end portion on a flexible circuit member.
    상세보기
  22. Kman Stephen Joseph ; Stubecki John Arthur ; Sondej William Richard, Method of forming a pinned module.
    상세보기
  23. Fjelstad, Joseph; Smith, John W.; DiStefano, Thomas H.; Zaccardi, James; Walton, A. Christian, Method of making an electronic contact.
    상세보기
  24. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.
    상세보기
  25. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
    상세보기
  26. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out.
    상세보기
  27. Distefano Thomas H. ; Smith ; Jr. John W., Methods of making connections to a microelectronic unit.
    상세보기
  28. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods.
    상세보기
  29. Fjelstad, Joseph; Beroz, Masud; Smith, John W.; Haba, Belgacem, Microelectric packages having deformed bonded leads and methods therefor.
    상세보기
  30. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.
    상세보기
  31. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.
    상세보기
  32. Eldridge,Benjamin N.; Grube,Gary W.; Khandros,Igor Y.; Mathieu,Gaetan L., Mounting spring elements on semiconductor devices, and wafer-level testing methodology.
    상세보기
  33. John W. Smith ; Belgacem Haba, Multi-layer substrates and fabrication processes.
    상세보기
  34. Smith, John W.; Haba, Belgacem, Multi-layer substrates and fabrication processes.
    상세보기
  35. Brodsky, William Louis; Chan, Benson; Gaynes, Michael Anthony; Markovich, Voya Rista, Printed wiring board interposer sub-assembly.
    상세보기
  36. Khandros, Jr., Igor Y.; Sporck, Jr., A. Nicholas; Eldridge, Jr., Benjamin N., Probe card assembly.
    상세보기
  37. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly.
    상세보기
  38. Eldridge, Benjamin N.; Khandros, Igor Y.; Sporck, A. Nicholas, Probe card assembly and kit.
    상세보기
  39. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly and kit.
    상세보기
  40. Khandros,Igor Y.; Sporck,A. Nicholas; Eldridge,Benjamin N., Probe card assembly and kit.
    상세보기
  41. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
    상세보기
  42. Khandros,Igor Y.; Mathieu,Gaetan L., Probe for semiconductor devices.
    상세보기
  43. Khandros,Igor Y.; Mathieu,Gaetan L., Probe for semiconductor devices.
    상세보기
  44. Donner Edward O. (Poughkeepsie NY) Zumbrunnen Michael L. (Rochester MN), Process for manufacture of spring contact elements and assembly thereof.
    상세보기
  45. Fjelstad Joseph, Process of manufacturing compliant wirebond packages.
    상세보기
  46. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Resilient contact structures for interconnecting electronic devices.
    상세보기
  47. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Resilient contact structures formed and then attached to a substrate.
    상세보기
  48. Khandros Igor Y. ; Mathieu Gaetar L., Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components.
    상세보기
  49. Ideta Yasushi,JPX ; Washitani Akihiro,JPX ; Umetsu Tsunenori,JPX ; Kaneko Keiko,JPX ; Kobayashi Kunio,JPX, Semiconductor device socket.
    상세보기
  50. Khandros Igor Y. ; Mathieu Gaetar L., Semiconductor devices with integral contact structures.
    상세보기
  51. DiStefano,Thomas H.; Smith,John W.; Faraci,Tony, Semiconductor package with heat sink.
    상세보기
  52. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
    상세보기
  53. Palmer Edward R.,GBX ; Stratford Colin,GBX, Surface mount electronic reed switch component with transverse lead wire loops.
    상세보기
  54. VanHouten, Dennis J.; Kring, Christopher S.; Sapak, Ben; Johnson, Jack L., Vehicle interior panel with integral wire harness.
    상세보기

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