$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for transferring wafers between cassettes and a boat 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-009/00
  • C23C-015/00
출원번호 US-0864077 (1986-05-16)
발명자 / 주소
  • Hugues Jean B. (Tempe AZ) Weber Lynn (Saratoga CA) Herlinger James E. (Palo Alto CA) Nishikawa Katsuhito (San Jose CA) Schuman Donald L. (Saratoga CA) Yee Gary W. (Santa Clara CA)
출원인 / 주소
  • Silicon Valley Group, Inc. (San Jose CA 02)
인용정보 피인용 횟수 : 156  인용 특허 : 0

초록

A wafer transfer mechanism used for transferring wafers between cassettes and a boat uses sensors to detect and to measure any offset of the actual center of each wafer being transferred with respect to the expected or precalibrated center of that wafer. An appropriate adjustment is made to effectiv

대표청구항

A wafer transfer mechanism for transferring a wafer from a source to a destination while compensating for any lateral offset of the actual location of the wafer center from the expected location of the wafer center in the source so that the wafer can be placed in the destination with the actual loca

이 특허를 인용한 특허 (156)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Hofmeister, Christopher; Hosek, Martin, Adaptive placement system and method.
  3. Harvey Danial D., Anti-wafer breakage detection system.
  4. Harvey Danial D., Anti-wafer breakage detection system.
  5. Oka Yoshiji,JPX ; Fukutomi Yoshiteru,JPX ; Itaba Masayuki,JPX ; Koyama Yasufumi,JPX ; Yuge Toshiya,JPX, Apparatus and method for detecting and conveying substrates in cassette.
  6. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  7. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  8. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  9. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  10. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  11. Schauer, Ronald Vern; Lappen, Alan Rick, Apparatus for alignment of automated workpiece handling systems.
  12. Weigand Peter (Alzenau DEX) Langen Harald (Babenhausen DEX) Kupka Hans J. (Neuberg DEX) Rossel Gerhard (Alzenau DEX) Weigand Walter (Freigericht DEX) Wittenbeck Rudiger (Hanau DEX) Hessler Karl-Heinz, Apparatus for automatically feeding a sequence of crucibles to a test oven.
  13. Harris,Randy; Woodruff,Daniel J., Apparatus for manually and automatically processing microelectronic workpieces.
  14. Brown, Paul D., Article transfer apparatus.
  15. Paul D. Brown, Article transfer apparatuses.
  16. Brown Paul D., Article transfer methods.
  17. Honma Manabu,JPX, Auto-teaching method in semiconductor processing system.
  18. Hosokawa Akihiro ; Demaray Richard Ernest ; Inagawa Makoto ; Mullapudi Ravi ; Halsey Harlan L. ; Starr Michael T., Automated substrate processing systems and methods.
  19. Doeuvne Jean P. (Meylan FRX) Mascarin Guy (Meylan FRX), Automatic apparatus for controlling the size of wafer-supporting boats.
  20. Emami, Arsalan Alan; Agamohamadi, Mitch; Sedehi, Saeed, Automation for high throughput semiconductor batch-wafer processing equipment.
  21. Yudovsky, Joseph; Cook, Robert C.; Merry, Nir, Batch deposition tool and compressed boat.
  22. Webb, Aaron; Brailove, Adam; Yudovsky, Joseph; Merry, Nir; Constant, Andrew; Quiles, Efrain; Rice, Michael R.; Rosen, Gary J.; Shah, Vinay K., Batch processing platform for ALD and CVD.
  23. Zejda Jaroslav (Rodenbach DEX), Cathode sputtering system.
  24. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX), Cathode sputtering system.
  25. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  26. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  27. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  28. Aho, Marc T.; Wilson, Thaddeus J., Compact multiple diameters wafer handling system with on-chuck wafer calibration and integrated cassette-chuck transfer.
  29. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  30. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  31. Roman, Jr.,Paul J.; Madsen,Harold O., Deposition of permanent polymer structures for OLED fabrication.
  32. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX), Device for accepting and holding a workpiece in vacuum coating apparatus.
  33. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  34. Genov ; deceased Genco ; Todorov Alexander ; Kostov Lubo ; Petkov Peter ; Totev Valentin ; Bonev Eugene ; Sotirov Zlatko, Dual robotic arm end effectors having independent yaw motion.
  35. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  36. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  37. Preston Whitcomb, Edge-gripping pre-aligner.
  38. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  39. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  40. Woodruff, Daniel J.; Erickson, James J., End-effectors and transfer devices for handling microelectronic workpieces.
  41. Woodruff,Daniel J.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic wafers.
  42. Woodruff,Daniel J.; Oberlitner,Thomas H.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic workpieces.
  43. Altwood Allen ; Colborne Kelly ; Fairbairn Kevin ; Lane Christopher ; Ponnekanti Hari K. ; Sundar Satish, Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding.
  44. Watanabe Shingo (Kanagawa JPX), Heat treatment apparatus.
  45. Ishii Katsumi (Fujino JPX) Wada Atsushi (Chofu JPX), Horizontal/vertical conversion transporting apparatus.
  46. Frank J. Ardezzone, IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors.
  47. Wytman Joe, Independent linear dual-blade robot and method for transferring wafers.
  48. Wytman Joe, Independent linear dual-blade robot and method for transferring wafers.
  49. Alexander Todorov ; Mila Genov, Integrated edge gripper.
  50. Woodruff, Daniel J.; Harris, Randy, Integrated tools with transfer devices for handling microelectronic workpieces.
  51. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  52. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  53. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  54. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  55. Yoshida,Tetsuya; Goto,Hirohiko, Mapping device.
  56. Schauer,Ronald Vern; Lappen,Alan Rick; Tuttle,David L., Method and apparatus for aligning a cassette.
  57. van den Berg, Jannes Remco; den Hartog, Edwin, Method and apparatus for batch processing of wafers in a furnace.
  58. Van Den Berg,Jannes Remco, Method and apparatus for loading a batch of wafers into a wafer boat.
  59. Lu,Zhimin, Method and apparatus to correct water drift.
  60. Chen Tien-Ya,TWX ; Tseng Chen-Chiu,TWX, Method and controlling system for preventing the scratching of wafer backs by the fetch arm of a stepper machine.
  61. De Ridder, Christianus Gerardus Maria, Method and system for loading substrate supports into a substrate holder.
  62. De Ridder,Christianus Gerardus Maria, Method and system for loading substrate supports into a substrate holder.
  63. Bonora Anthony C. ; Fosnight William J. ; Swamy Krishna D. ; Davis Mark R. ; Cookson Mike, Method for in-cassette wafer center determination.
  64. Hiroshi Kojima JP, Method for transferring a dummy wafer.
  65. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  66. Lee, Wai M.; Maloney, David J.; Roman, Paul J.; Fury, Michael A.; Hill, Ross H.; Henderson, Clifford; Barstow, Sean, Method of and apparatus for substrate pre-treatment.
  67. Nakahara Kanefumi,JPX, Method of carrying and aligning a substrate.
  68. Hill,Ross H.; Blair,Sharon Louise; Li,Grace; Zhang,Xin; Ruan,Haixiong, Method of depositing patterned films of materials using a positive imaging process.
  69. Maloney,David J.; Lee,Wai M.; Roman, Jr.,Paul J.; Fury,Michael A., Method of making barrier layers.
  70. Maloney, David J.; Lee, Wai M.; Roman, Jr., Paul J.; Fury, Michael A.; Hill, Ross H., Method of making electronic materials.
  71. Sasaki, Takaaki, Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected.
  72. Kanefumi Nakahara JP, Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate.
  73. Woodruff, Daniel J.; Harris, Randy, Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces.
  74. Rice,Michael R.; Englhardt,Eric A.; Lowrance,Robert B.; Elliott,Martin R.; Hudgens,Jeffrey C.; Van Katwyk,Kirk; Puri,Amitabh, Monitoring of smart pin transition timing.
  75. Brown Karl, Monitoring of wafer presence and position in semiconductor processing operations.
  76. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  77. Higgison John R. (Huntsville AL) Derriso Thomas E. (Huntsville AL), Optical disc counter.
  78. Fischer John G. (Irving TX), Photoelectric mensuration device and method for determining PDC cutter wear.
  79. Uehara Akira,JPX ; Minato Mitsuaki,JPX ; Kawamura Yoshitsugu,JPX, Plasma processing apparatus.
  80. Takizawa, Masahiro; Suwada, Masaei, Position sensor system for substrate transfer robot.
  81. Wenning Nathan P. ; Schoch Daniel A., Press production monitoring system and method.
  82. Learn, Arthur J.; Du Bois, Dale R.; Miller, Nicholas E.; Seilheimer, Richard A., Primary flow CVD apparatus comprising gas preheater and means for substantially eddy-free gas flow.
  83. Grutzediek Hartmut,DEX ; Scheerer Joachim,DEX, Procedure and facility for handling and transport of wafers in ultra-clean rooms.
  84. Grutzediek Hartmut,DEX ; Scheerer Joachim,DEX, Procedure and facility for handling and transport of wafers in ultra-clean rooms.
  85. Hanson, Kyle M.; Eudy, Steve L.; Ritzdorf, Thomas L.; Wilson, Gregory J.; Woodruff, Daniel J.; Harris, Randy; Weber, Curtis A.; McGlenn, Tim; Anderson, Timothy A.; Bexten, Daniel P., Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces.
  86. Katsumi Ishii JP, Processing unit for a substrate.
  87. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  88. Seguro Masayuki,JPX ; Terakado Yoshimitsu,JPX ; Mochida Toru,JPX, Raising-and-lowering data setting method for magazine elevator device.
  89. Catey Eric B. ; Hult David ; Puerto Santiago del ; Roux Stephen, Removable cover for protecting a reticle, system including and method of using the same.
  90. Hosek, Martin; Lipcon, Jacob, Robot adaptive placement system with end-effector position estimation.
  91. Hillman Gary, Robot having a centering and flat finding means.
  92. Genov Genco ; Todorov Alexander ; Kostov Lubo ; Petkov Peter ; Totev Valentin ; Bonev Eugene ; Sotirov Zlatko, Robot having multiple degrees of freedom.
  93. Genco Genov ; Zlatko M. Sotirov ; Eugene Bonev, Robot motion compensation system.
  94. Dobbs Michael E. (Brighton MI) Jones Donald B. (Ann Arbor MI), Robotic substrate manipulator.
  95. Tepolt Gary B., Robotic wafer handler.
  96. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  97. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  98. Nichols, Michael J.; Guarracina, Louis J., Self-sterilizing automated incubator.
  99. Morimitsu,Kazuhiro; Matsunaga,Tatsuhisa; Kaneko,Masanori; Noto,Kouichi; Yanagawa,Hidehiro; Matsushima,Masaki, Semiconductor device producing apparatus and producing method of semiconductor device.
  100. Sasaki, Takaaki, Semiconductor device, semiconductor package for use therein, and manufacturing method thereof.
  101. Sasaki, Takaaki, Semiconductor device, semiconductor package for use therein, and manufacturing method thereof.
  102. Sasaki, Takaaki, Semiconductor device, semiconductor package for use therein, and manufacturing method thereof.
  103. Sasaki,Takaaki, Semiconductor device, semiconductor package for use therein, and manufacturing method thereof.
  104. Sasaki,Takaaki, Semiconductor device, semiconductor package for use therein, and manufacturing method thereof.
  105. Sasaki Takaaki,JPX, Semiconductor package.
  106. Bolton Douglas A. ; Wiesen Patrick W., Semiconductor thermal processor with recirculating heater exhaust cooling system.
  107. Raaijmakers, Ivo, Semiconductor wafer position shift measurement and correction.
  108. Raaijmakers,Ivo, Semiconductor wafer position shift measurement and correction.
  109. Howells John ; Peltola Randall W., Semiconductor wafer transfer method and apparatus.
  110. Oda Tatehumi,JPX, Semiconductor wafer transporter.
  111. Ohkase Wataru (Sagamihara JPX) Sato Seishiro (Machida JPX), Semiconductor wafer treating apparatus.
  112. Yang, Chunyu; Yuan, Man; Zhang, Ji; Zhang, Wei; Yin, Yongzhi; Liu, Yanhong, Separation device for backlight source.
  113. Hasper,Albert; Nooten,Sebastiaan Eliza; Hendriks,Menso, Sorting/storage device for wafers and method for handling thereof.
  114. Krupyshev, Alexander G.; Syssoev, Sergei E., Substrate alignment apparatus comprising a controller to measure alignment during transport.
  115. Matsunaga, Tatsuhisa; Noto, Kouichi, Substrate processing apparatus.
  116. Tometsuka, Kouji, Substrate processing apparatus.
  117. Mishima,Koji; Kunisawa,Junji; Makino,Natsuki; Kimura,Norio; Inoue,Hiroaki; Nakamura,Kenji; Matsumoto,Moriji; Nanjo,Takahiro; Odagaki,Mitsuko, Substrate processing apparatus and substrate plating apparatus.
  118. Hara, Shiro; Maekawa, Hitoshi, Substrate transfer antechamber mechanism.
  119. Abe, Yo; Obara, Mitsuru; Abe, Takahiro, Substrate transfer apparatus, substrate transfer method, and storage medium.
  120. Iwasaki Tatsuya,JPX, Substrate transferring apparatus and substrate processing apparatus using the same.
  121. Miyamoto, Yukiteru, Substrate treating apparatus, and a substrate transporting method therefor.
  122. Oosterlaken,Theodorus Gerardus Maria, Susceptor plate for high temperature heat treatment.
  123. Sarver, Roger; Qualey, Christopher, System and method for calibrating a wafer handling robot and a wafer cassette.
  124. Sakamoto,Koichi; Tonegawa,Yamato; Fujita,Takehiko, System and method for performing semiconductor processing on substrate being processed.
  125. Sakamoto, Koichi; Tonegawa, Yamato; Fujita, Takehiko, System and method for performing semiconductor processing on target substrate.
  126. Del Puerto, Santiago; Loopstra, Erik R.; Massar, Andrew; Kish, Duane P.; Alikhan, Abdullah; Olsen, Woodrow J.; Feroce, Jonathan H., System and method for using a two part cover and a box for protecting a reticle.
  127. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  128. Christianus Gerardus Maria De Ridder NL, System for loading, processing and unloading substrates arranged on a carrier.
  129. Maher Joseph A. ; Vowles E. John ; Napoli Joseph D. ; Zafiropoulo Arthur W. ; Miller Mark W., System for processing substrates.
  130. Walker Delroy (Springdale MD) Zihmer Joseph (Frederick MD) Furches Danny (Columbia MD) Garmer Christopher J. (Rockville MD), System for transferring articles between controlled environments.
  131. Steven E. Reder ; Ynhi T. Le, System to reduce particulate contamination.
  132. Woodruff, Daniel J.; Harris, Randy, TRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF A PROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICES IN THE PROCESSING OF MICROELECTRONIC WORKPIE.
  133. Fairbairn, Kevin; Barzilai, Jessica; Ponnekanti, Hari K.; Taylor, W. N. (Nick), Tandem process chamber.
  134. Kumasaka Iwao,JPX ; Usui Kazuhiko,JPX, Teaching method for loading arm for objects to be processed.
  135. Kowalski Jeffrey M. ; Ratliff Christopher T. ; Koble ; Jr. Terry A. ; Pack Jon H. ; Yang Michael H., Thermal processing apparatus.
  136. Kim, Se Yong; Kim, Woo Chan; Jung, Dong Rak, Thin film deposition apparatus and method of maintaining the same.
  137. Kim, Ki Jong; Kim, Dae Youn, Thin film deposition apparatus and method thereof.
  138. Hill,Ross H.; Roman, Jr.,Paul J.; Suh,Seigi; Zhang,Xin, Titanium carboxylate films for use in semiconductor processing.
  139. Nishi Hironobu (Sagamihara JPX), Transfer device.
  140. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  141. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  142. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  143. Bacchi Paul ; Filipski Paul S., Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism.
  144. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
  145. Haraki, Kenjiro; Yamamoto, Hiroyuki; Uemura, Satoshi; Tsunoda, Yuji; Takeuchi, Yasushi; Kaneko, Hirofumi, Vertical heat treatment apparatus and method for operating the same.
  146. Bonora, Anthony C.; Gould, Richard H.; Hine, Roger G.; Krolak, Michael; Speasl, Jerry A., Wafer engine.
  147. Bonora,Anthony C.; Gould,Richard H.; Hine,Roger G.; Krolak,Michael; Speasl,Jerry A., Wafer engine.
  148. Chrisos John M. (Beverly MA) Fowler ; Jr. Bertram F. (Danvers MA) Muka Richard S. (Topsfield MA), Wafer handling apparatus.
  149. Howells John ; Gorman Andrew P. ; Peltola Randall W., Wafer handling system and method.
  150. Freerks Frederik W. ; Berken Lloyd M. ; Crithfield M. Uenia ; Schott David ; Rice Michael ; Holtzman Michael,ILX ; Reams William ; Giljum Richard ; Reinke Lance ; Booth John S., Wafer position error detection and correction system.
  151. Shimane Kazuo (Kawasaki JPX) Iijima Nobuo (Tama JPX) Kawabata Tatsuro (Kawasaki JPX), Wafer positioning apparatus.
  152. Berken Lloyd M. (Fremont CA) Freerks Frederik W. (Cupertino CA) Jarvi William H. (San Jose CA) Sahin Hatice (Cupertino CA), Wafer positioning system.
  153. Berken Lloyd M. ; Freerks Frederik W. ; Jarvi William H. ; Sahin Hatice, Wafer positioning system.
  154. Ohtani Masami (Kyoto JPX) Nishida Masami (Kyoto JPX), Wafer transfer apparatus having an improved wafer transfer portion.
  155. Joe Wytman ; Ivo Raaijmakers, Water lift mechanism with electrostatic pickup and method for transferring a workpiece.
  156. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로