초록 ▼

Contamination of wafers is reduced by an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers. Process fluids flow sequentially and continuously past the wafers such that the processing does not require movement or operator handling of the wafers

Contamination of wafers is reduced by an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers. Process fluids flow sequentially and continuously past the wafers such that the processing does not require movement or operator handling of the wafers between processing steps. The vessel containing the wafers is hydraulically full during each process step. Wafers may be cleaned using a hot corrosive fluid, such as sulfuric acid; rinsed using high purity water at high flow rates; and dried using a drying fluid such an isopropanol. In addition, chemical reagents such as dilute hydrofluoric acid or hydrogen peroxide may be precisely mixed in situ and applied to the wafer surface for a precisely controlled period, by injecting concentrated reagent into rinse water purified by multipass filtration.

대표청구항 ▼

An enclosed, full flow method for the cleaning of semiconductor wafers comprising positioning said wafers in a vessel, closing said vessel to the environment, and flowing process fluids sequentially and continuously past said wafers in said vessel, including the steps of (a) contacting said wafers w

An enclosed, full flow method for the cleaning of semiconductor wafers comprising positioning said wafers in a vessel, closing said vessel to the environment, and flowing process fluids sequentially and continuously past said wafers in said vessel, including the steps of (a) contacting said wafers with at least one cleaning fluid to remove contaminants from said wafers; (b) removing said cleaning fluid from said wafers with a rinsing fluid; and (c) removing said rinsing fluid from said wafers with a drying fluid; whereby the processing does not requirement movement or operator handling of said wafers between said steps; and maintaining the vessel containing said wafers hydraulically full during each process step. An enclosed, full flow method for the treatment of semiconductor wafers comprising positioning said wafers in a vessel, closing said vessel to the environment, and flowing process fluids in sequential steps continuously past said wafers in said vessel, including the step of rinsing the surface of said wafers with at least one rinsing fluid and subsequently removing said rinsing fluid with a drying fluid whereby the processing does not require movement or handling of said wafers between process steps and maintaining the vessel containing said wafers is hydraulically full during each process step.