초록 ▼

Improved adhesive attachments and related mounting fixtures and methods are provided for secure mounting of an adhesive attachment to a substrate. In one preferred form, the adhesive attachment comprises an enlarged attachment base locked in sandwiched relation between multiple laminations of prebon

Improved adhesive attachments and related mounting fixtures and methods are provided for secure mounting of an adhesive attachment to a substrate. In one preferred form, the adhesive attachment comprises an enlarged attachment base locked in sandwiched relation between multiple laminations of prebonded composite material to define an enlarged composite footplate with an extended composite material surface for secure bonding onto a substrate of composite material. The attachment is pressed against the substrate with an appropriate bonding agent at the attachment/substrate interface by a mounting fixture which is connected at least temporarily to the substrate and includes a spring member applying a positive force pressing the attachment toward the substrate. Alternative adhesive attachments formed from multiple components are also disclosed.

대표청구항 ▼

A mounting fixture for mounting an adhesive attachment having a bonding agent thereon onto a substrate, comprising: spring means for supporting the adhesive attachment, said spring means being normally in a first position and movable to a second position; connector means carrying said spring means a

A mounting fixture for mounting an adhesive attachment having a bonding agent thereon onto a substrate, comprising: spring means for supporting the adhesive attachment, said spring means being normally in a first position and movable to a second position; connector means carrying said spring means and having means for at least temporary connection of said connector means to the substrate, said connector means carrying said spring means in said first position with the attachment oriented to land upon the substrate prior to said connector means upon movement thereof toward the substrate, and with the bonding agent interposed between the substrate and the adhesive attachment, said spring means being movable to said second position upon further movement of said connector means toward the substrate to land said connector means thereon; said spring means applying a positive force when in said second position pressing the attachment toward the substrate; and further including an installation tool for placing said mounting fixture while supporting the adhesive attachment onto the substrate, said installation tool including means for moving said connector means into at least temporary connection with the substrate and for concurrently permitting displacement of said spring means from said first position to said second position, said installation tool including means for activating the bonding agent at the interface between the adhesive attachment and substrate to initiate curing of the bonding agent.