초록 ▼

The pad of the present invention is comprised of a thin film of high dielectric strength material which is impregnated with diamond powder. The diamond pieces are relatively uniform in size and have a minimum dimension which is greater than the thickness of the film. In one embodiment, a 5,000-10,00

The pad of the present invention is comprised of a thin film of high dielectric strength material which is impregnated with diamond powder. The diamond pieces are relatively uniform in size and have a minimum dimension which is greater than the thickness of the film. In one embodiment, a 5,000-10,000 angstrom boundary layer of copper is formed on both sides of the film by a vacuum deposition or electroless dipping and thicker cover layers are electroplated on top of this boundary layer, if desired, to make the pad rigid. In addition, a copper or aluminum substrate can be clad to one or both cover layers to provide additional rigidity.

대표청구항 ▼

A pad for thermally joining and electrically insulating a heat-generating electronic component and a heat sink, said pad comprising: a thin film of high dielectric strength material having top and bottom major surfaces; a plurality of substantially uniform size diamond pieces imbedded in said film,

A pad for thermally joining and electrically insulating a heat-generating electronic component and a heat sink, said pad comprising: a thin film of high dielectric strength material having top and bottom major surfaces; a plurality of substantially uniform size diamond pieces imbedded in said film, each of said diamond pieces having a first portion protruding through said top surface of said film and a second portion protruding through said bottom surface of said film; and a first thin layer of a high thermal conductivity material bonded to said top surface of said film and a second thin layer of a high thermal conductivity material bonded to said bottom surface of said film, said first thin layer and said second thin layer contacting said first and second portions of said diamond pieces protruding through said film surfaces, said first and second thin layers ensuring a direct heat transfer path between said electronic component and said heat sink.