초록 ▼

A surface inspection apparatus is equipped with a transfer machine which includes a first storage unit for storing a plurality of wafers therein, a first transfer portion for receiving the wafers from the first storage unit one by one and transferring them along a horizontal plane, a first receiver

A surface inspection apparatus is equipped with a transfer machine which includes a first storage unit for storing a plurality of wafers therein, a first transfer portion for receiving the wafers from the first storage unit one by one and transferring them along a horizontal plane, a first receiver moving vertically between a lower position and an upper position for receiving the wafers from the first transfer portion when the first receiver moves from its lower position to its upper position and moving them up and down, a chuck moving to a predetermined position under the wafers received by the first receiver when the first receiver is at or near its upper position and receiving the inspected elements from the first receiver when the first receiver moves from its upper position to its lower position, the chuck holding the wafers in their fixed condition and moving them in a given direction along a horizontal plane while they are inspected, a second receiver moving vertically between a lower position and an upper position for receiving the wafers from the chuck when the second receiver moves from its lower position to its upper position, a second transfer portion for receiving the wafers from the second receiver when the second receiver moves from its upper position to its lower position and transferring them along a horizontal plane, and a second storage unit for receiving the wafers from the second transfer portion and storing them therein.

대표청구항 ▼

A transfer machine for a surface inspection apparatus comprising: a first storage means positioned at a first point for storing a plurality of wafers therein; a first transfer means for receiving the wafers from the first storage means one by one in order and transferring the wafers; a first receive

A transfer machine for a surface inspection apparatus comprising: a first storage means positioned at a first point for storing a plurality of wafers therein; a first transfer means for receiving the wafers from the first storage means one by one in order and transferring the wafers; a first receiver means for receiving the wafers from the first transfer means one by one, the first receiver means being movable vertically between a lower position and an upper position, so as to receive each of the wafers from the first transfer means at its lower position and moving with the wafer to its upper position; a chuck means for receiving each of the wafers from the first receiver means and holding each of the wafers, the chuck means being movable only along a horizontal plane in such a manner that the chuck means can move to a predetermined point positioned under each of the wafers which is received by the first receiver means when the first receiver means is at, or near, its upper position and the chuck means can receive each of the wafers from the first receiver means when the first receiver means moves from its upper position to its lower position; a second receiver means for receiving each of the wafers from the chuck means, the second receiver means being movable vertically between a lower position and an upper position, for receiving each of the wafers from the chuck means at its lower position and moving with the wafer to its upper position; a second transfer means for receiving the wafers from the second receiver means one by one and transferring the wafers, the second transfer means being designed to receive each of the wafers from the second receiver means when the second receiver means moves from its upper position to its lower position, so as to transfer the wafers from the second receiver means to the second storage means; a second storage means for receiving the wafers from the second transfer means one by one in order and storing the wafers therein; and means for moving horizontally the chuck means along a given horizontal moving course between the first receiver means and the second receiver means while the chuck means continues to hold each of the wafers; wherein the first and second receiver means have a receiving edge for supporting a peripheral portion of each of the wafers, the receiving edge having a cut portion thereof so as to prevent the chuck means from interfering with the first and second receiver means in operation.