초록 ▼

A viad chip resistor made from an insulative wafer and having a via formed near end of the wafer. Conductive pads surround the vias on both sides of the wafer. A resistive element is formed on one side of the wafer between the vias and is electrically connected to the conductive pads on that side. A

A viad chip resistor made from an insulative wafer and having a via formed near end of the wafer. Conductive pads surround the vias on both sides of the wafer. A resistive element is formed on one side of the wafer between the vias and is electrically connected to the conductive pads on that side. An array of viad chip resistors, from which said individual viad chip resistors are cut, is also shown.

대표청구항 ▼

An array of spaced electrical circuit components, comprising: (a) a substrate of electrically insulating material having first and second surfaces; (b) spaced apart rows of vias in said substrate, the rows having a pattern comprising single rows and double rows, the vias being inward from the edges

An array of spaced electrical circuit components, comprising: (a) a substrate of electrically insulating material having first and second surfaces; (b) spaced apart rows of vias in said substrate, the rows having a pattern comprising single rows and double rows, the vias being inward from the edges of the substrate; (c) conductive material regions, each surrounding at least one via on said first and second surfaces of said substrate; (d) conductive material within said vias and electrically interconnecting the conductive material regions on the first and second surfaces surrounding those vias; and (e) resistor elements on a surface of said substrate, each resistor element electrically interconnecting two conductive material regions, a conductive material region being associated with a double row of said vias, no via in the substrate being used in conjunction with more than one resistor element.