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Data carrier having an integrated circuit and method for producing same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-019/06
  • H01L-023/30
  • G11C-011/34
출원번호 US-0106890 (1987-10-13)
우선권정보 DE-3338597 (1984-10-24)
발명자 / 주소
  • Haghiri-Tehrani Yahya (Winzerer Str. 98 8000 Mnchen 40 DEX) Hoppe Joachim (Breisacher Str. 1 8000 Mnchen 80 DEX)
인용정보 피인용 횟수 : 53  인용 특허 : 4

초록

A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carr

대표청구항

A multilayer data carrier, such as a laminated card, comprising: a core layer including at least one recess; upper and lower cover layers on opposite sides of the core layer, at least said upper layer including at least one aperture; an IC module for processing electrical signals; a flexible, filmli

이 특허에 인용된 특허 (4)

  1. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Carrier element for an IC module.
  2. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), IC-module identification card.
  3. Monnier, Michel J.; Monneraye, Marc A.; Foucher, Claude; Le Marchant, Pierre, Portable, identifying element constructed as a lamination of sheets.
  4. Badet Bernard (Rosny-sous-Bois FRX) Guillaume Francois (St Leu la Foret FRX) Kurzweil Karel (Eaubonne FRX), Standardized information card.

이 특허를 인용한 특허 (53)

  1. Reed, Paul, Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards.
  2. Haghiri-Tehrani Yahya (Munchen DEX), Chip card and a method for producing it.
  3. Hafner Karlheinz,DEX ; Mehrgardt Sonke,DEX, Data carrier card, assembly of at least two data carrier cards and method of accessing at least one of the data carrier.
  4. Tsunoda,Shigeharu; Hozoji,Hiroshi; Minagawa,Madoka, Electronic device, rubber product, and methods for manufacturing the same.
  5. Michael Zafrany FR; Philippe Patrice FR, Electronic module for chip card.
  6. Zafrany, Michael; Patrice, Philippe, Electronic module for chip card.
  7. Williams, Troy P.; Vaughn, Peter A.; Web, Lisa Ann Morrill, Foldable transaction card systems.
  8. Williams, Troy; Vaughn, Peter A.; Morrill Webb, Lisa Ann, Foldable transaction card systems.
  9. Gandel, Priscilla; Lasch, Ellen; Morrill Webb, Lisa Ann, Foldable transaction cards and methods of making the same.
  10. Gandel, Priscilla; Lasch, Ellen; Webb, Lisa Ann Morrill, Foldable transaction cards and methods of making the same.
  11. Leighton, Keith R., Hot lamination process for the manufacture of a combination contact/contactless smart card.
  12. Leighton Keith, Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom.
  13. Kodai Syojiro (Itami JPX) Ochi Katsunori (Itami JPX), IC card.
  14. Yabe Isao (Tokorozawa JPX) Shimada Yoshihiro (Tokyo JPX) Machida Kazumi (Higashiyamato JPX) Kaneko Hiroyuki (Kunitachi JPX), IC card.
  15. Sasaki, Koji; Saito, Naoto; Miura, Hideo; Ohta, Hiroyuki; Matsumoto, Kunio; Yoshino, Ryozo, IC card and its manufacturing method.
  16. Norman A. Conti ; Paul B. Germeraad, Label/tag with embedded signaling device and method and apparatus for making and using.
  17. Florek, Miroslav; Mihályová, Tatiana, Memory card.
  18. Reed, Paul, Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces.
  19. Reed,Paul, Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces.
  20. Tiffany ; III Harry J., Method for making tamper-preventing, contact-type, smart cards.
  21. Bouchez, Francoise; Launay, Francois; Loubly, Pierre; Venambre, Jacques, Method for mounting a microcircuit in a cavity of a card forming a support and resulting card.
  22. Huber, Peter; Kohl, Klaus; Roman, Fabik; Schellenberger, Christina; Schropf, Manuela, Method for producing a finishing layer containing a window for a portable data storage medium and said finishing layer.
  23. Hoeppner, Harald; Radtke, Michael; Märtens, Detlef; Paeschke, Manfred; Ehreke, Jens; Löer, Thomas; Seidel, Rainer; Knebel, Michael, Method for the production of a book cover insert and book-type security document and book cover insert and book-type security document.
  24. Tsao, Paul; Brown, Kerry D., Payment card manufacturing technology.
  25. Long Jon ; McCormick John, Power plane for semiconductor device.
  26. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification ca.
  27. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards.
  28. Lankinen, Mikko; Syrjanen, Taru, Security document and method of manufacturing security document.
  29. Beals, William Michael; Goupil, Hervé, Smart card interface.
  30. Beals, William Michael; Goupil, Hervé, Smart card interface.
  31. Beals, William Michael; Goupil, Hervé, Smart card interface.
  32. Beals, William Michael; Goupil, Hervé, Smart card interface.
  33. Beals, William Michael; Goupil, Hervé, Smart card interface.
  34. Beals, William Michael; Goupil, Hervé, Smart card interface.
  35. Beals, William Michael; Goupil, Hervé, Smart card interface.
  36. Beals, William Michael; Goupil, Hervé, Smart card interface.
  37. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  38. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  39. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  40. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  41. F체rst,Stefan; Moser,Michael; Stelzig,Heinrich; Rathmann,Claudia; Birke Salam,Fatima; Ilic,Dejan; Bosch,Ulrich; Woehrle,Thomas, Thin electronic chip card and method of making same.
  42. Charlier, Gerard; Philippe, Eric Luc, Token with an electronic chip and methods for manufacturing the same.
  43. Vogt,Werner, Transponder label.
  44. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  45. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  46. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  47. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  48. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.
  49. Perrine, Jerome; Goupil, Hervé; van Riek, Maurice Gerard; Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, USB interface for performing transport I/O.
  50. Tane Yasuo,JPX ; Tanaka Kazuyasu,JPX, Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein.
  51. Keith R. Leighton, Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  52. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  53. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.
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