Metallized polymer compositions, processes for their preparation and their uses
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B05D-005/12
H01B-001/02
C23C-014/00
출원번호
US-0861231
(1986-05-08)
우선권정보
GB-0011905 (1985-05-10)
발명자
/ 주소
Cooray Boyd (Bamford GBX) Hope Peter (MK Twello NLX) Vleggaar Jan (HB Doetinchem NLX) Helle Kees (JS Bennekom NLX) Roos Arie (ET Velp NLX)
출원인 / 주소
Akzo N.V. (NLX 03)
인용정보
피인용 횟수 :
26인용 특허 :
1
초록▼
Metallized polymer compositions are disclosed, the surface of which comprises an intermetallic compound of a metal element A (Sn, As, Sb or Bi) and a metal element B (Fe, Co, Ni, Cu, Zn, Ga, Ru, Rh, Pd, Ag, Cd or In), preferably an intermetallic compound of antimony and a metal element B. Processes
Metallized polymer compositions are disclosed, the surface of which comprises an intermetallic compound of a metal element A (Sn, As, Sb or Bi) and a metal element B (Fe, Co, Ni, Cu, Zn, Ga, Ru, Rh, Pd, Ag, Cd or In), preferably an intermetallic compound of antimony and a metal element B. Processes for producing such metallized polymer compositions involve either the reduction of a metal element A compound in the presence of metallic metal element B and the polymer or the compression of a laminate of metal element A and metal element B layers onto the polymer. The metallized polymers are useful in the production of printing circuit boards, electromagnetic interference shielding devices, membrane switches, capacitors, conductive fibers, magnetic tapes and disc, antistatic mats, barrier polymers and optical storage devices.
대표청구항▼
A process for preparing a metallized polymer composition comprising reacting a compound or mixture of compounds containing a positive valent metal element A selected from the group consisting of tin, arsenic, antimony and bismuth with a metallic source of a metal element B selected from the group co
A process for preparing a metallized polymer composition comprising reacting a compound or mixture of compounds containing a positive valent metal element A selected from the group consisting of tin, arsenic, antimony and bismuth with a metallic source of a metal element B selected from the group consisting of iron, cobalt, nickel, copper, zinc, gallium, ruthenium, rhodium, palladium, silver, cadmium, and indium at the surface of said polymer composition at a temperature and pressure appropriate for obtaining a surface layer on the polymer composition comprising an intermetallic combination containing both the metal element A and the metal element B.
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이 특허에 인용된 특허 (1)
Krause Lawrence J. (Chicago IL), Electroless metal plating of plastics.
Hubbell,Jeffrey A.; Bearinger,Jane P.; Napoli,Alessandro; Textor,Marcus; Tirelli,Nicola, Coating hydrophobic surfaces with amphiphilic thioethers to reduce protein adsorption and cell adhesion.
Parr William J. E. (Naperville IL) Hutton Ronald E. (Faversham IL GB2) Moy Paul Y. Y. (Des Plaines IL) Frank Dieter (Naperville IL) Strawser David A. (Prospect Heights IL), Conductive metallization of substrates via developing agents.
Angelopoulos Anastasios Peter ; Jones Gerald Walter ; Matienzo Luis Jesus ; Miller Thomas Richard ; Markovich Voya Rista, Method for reducing seed deposition in electroless plating.
Angelopoulos Anastasios Peter ; Jones Gerald Walter ; Matienzo Luis Jesus ; Miller Thomas Richard ; Markovich Voya Rista, Method for reducing seed deposition in electroless plating.
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