초록 ▼

A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, includin

A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

대표청구항 ▼

A carrier element for an IC-chip suitable for incorporation, as a unit, into a financial or identification card, said carrier element comprising: a single layer carrier stratum having an aperture with a periphery, said carrier stratum further having recesses outside the periphery of said aperture th

A carrier element for an IC-chip suitable for incorporation, as a unit, into a financial or identification card, said carrier element comprising: a single layer carrier stratum having an aperture with a periphery, said carrier stratum further having recesses outside the periphery of said aperture through said stratum; an electrically conductive film laminated to said carrier stratum and spanning said recesses; contact surfaces formed out of said electrically conductive film but electrically isolated therefrom, said contact surface lying outside the periphery of said aperture and accessible through said recesses; an IC-chip positioned in the aperture of said carrier stratum; connection means in said recesses for connecting said IC-chip to said contact surfaces, said connection means being unsupported by said carrier stratum; and a hardened resin filling said aperture and recesses, said resin surrounding said IC-chip in said aperture and said connection means in said recesses.