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NTIS 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0090608 (1987-08-28) |
발명자 / 주소 |
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인용정보 | 피인용 횟수 : 149 인용 특허 : 0 |
The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact,
A method for bonding two surfaces together without applying heat, the bond being formed via a metal matrix that is created when the two surfaces, having been prepared so that both surfaces have an outermost layer of aluminum, are brought into contact with each other in a manner so as to displace any
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