초록

The invention is directed to a method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes while maintaining excellent X-Y dimensional stability.

대표청구항 ▼

A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable electrically insulative substrate; (b) applying to the substrate a patterned conductive layer; (c) firing the patterned conductive layer; (d) laminating to the fired patterned

A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) providing a dimensionally stable electrically insulative substrate; (b) applying to the substrate a patterned conductive layer; (c) firing the patterned conductive layer; (d) laminating to the fired patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape; (e) forming vias in selected positions through the layer of dielectric green tape in registration with the fired patterned conductive layer of step (c); (f) firing the laminated dielectric green tape layer; (g) filling the vias in the dielectric tape layer with a conductive metallization; (h) firing the filled vias in the dielectric tape layer; (i) applying a patterned conductive layer to the dielectric tape layer in registry with the vias therein; (j) firing the patterned conductive layer; and (k) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (d) through (j) until the desired number of circuit layers has been obtained.