초록 ▼

A method for preparing and maintaining an electroless plating bath. Seeded surfaces include a palladium and tin coating which receives plating from an electroless plating bath. The plating bath conditions are maintained by measuring the open circuit potential of the bath with a potentiostat. The che

A method for preparing and maintaining an electroless plating bath. Seeded surfaces include a palladium and tin coating which receives plating from an electroless plating bath. The plating bath conditions are maintained by measuring the open circuit potential of the bath with a potentiostat. The chemical constituent concentration levels are adjusted to a first open circuit potential for the bath. Air is removed from the bath and the open circuit potential increases to a second level representing a bath chemical activity which produces optimum electroless plating on the seeded surfaces. Parts having seeded surfaces are inserted in the bath and a flow of air is re-established in the bath, rendering less negative the open circuit voltage potential during plating of the parts.

대표청구항 ▼

A method for preparing an electroless plating bath for plating parts having a seeded surface, said bath comprising a plurality of chemical constituents, including air, which are controlled to achieve a desired plating condition comprising: measuring the open circuit potential of said bath Emix; adju

A method for preparing an electroless plating bath for plating parts having a seeded surface, said bath comprising a plurality of chemical constituents, including air, which are controlled to achieve a desired plating condition comprising: measuring the open circuit potential of said bath Emix; adjusting some of said bath chemical constituent concentration levels within a predetermined range until a first Emix potential between a working electrode and a reference electrode immersion in said bath is reached; removing air from said bath, whereby said bath open circuit Emix potential reaches a second Emix below an Emix level which produces undesirable nodules on parts in said bath; inserting seeded parts to be plated in said bath; re-establishing a flow of air in said bath, whereby said Emix potential decreases during plating of said parts.