초록 ▼

A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with

A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon. The coating is thicker on at least one of the two lateral core surfaces so that heat collected from the semiconductor device at the top surface of the thermally conducting coating is efficiently transferrred via the lateral surface or surfaces on the core to the portion of the thermally conducting coating on the bottom surface of the member.

대표청구항 ▼

A heat dissipating member for mounting a semiconductor device comprising a metal core having top, bottom and two lateral surfaces formed of a first metal having a selected coefficient of thermal expansion and a predetermined thermal conductivity, and a thermally conducting outer metal coating which

A heat dissipating member for mounting a semiconductor device comprising a metal core having top, bottom and two lateral surfaces formed of a first metal having a selected coefficient of thermal expansion and a predetermined thermal conductivity, and a thermally conducting outer metal coating which is metallurgically bonded to top, bottom and two lateral surfaces of the core so that one portion of the coating extends over the top surface of the core, another portion of the coating extends over the bottom surface of the core, and portions of the coating on the lateral surfaces of the core extend in heat-transfer relation between portions of the coating on the top and bottom of the core being formed of a second metal having a thermal conductivity relatively greater than said predetermined thermal conductivity and a coefficient of thermal expansion relatively greater than said selected coefficient of thermal expansion, the coating on the top surface of the core having selected thickness characteristics relative to the core and being metallurgically bonded to the core cooperating with the core in providing an outer surface portion of the coating over the top core surface having a predetermined effective coefficient of thermal expansion which is substantially less than the coefficient of thermal expansion of the coating material for reliably mounting a semiconductor device thereon and having relatively greater thickness of said thermally conducting coating on at least one lateral surface of the core than on the top surface of the core providing improved heat dissipation via heat transfer from the thermally conductive coating on the top and lateral surfaces of the core to the thermally conductive coating on the bottom surface of the core.