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A circuit board having multiple layers of a dielectric material, multiple layers of a conductive metal and multiple layers of graphite bonded together to form a composite multilayer printed circuit board having a desired coefficient of expansion and having strip and microstrip transmission lines for

A circuit board having multiple layers of a dielectric material, multiple layers of a conductive metal and multiple layers of graphite bonded together to form a composite multilayer printed circuit board having a desired coefficient of expansion and having strip and microstrip transmission lines for electrically connecting very high frequency electronic components mounted on the circuit board. The multiple layers of graphite are positioned in a symmetrical manner with respect to the thickness of the circuit board and selected in number to provide the circuit board with a desired coefficient of expansion. In addition, at least some of the layers of graphite are positioned in close proximity to some of the layers of conductive metal to provide enhanced thermal conduction from the mounted components.

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A high-frequency multilayer printed circuit, comprising: a plurality of layers of a conductive metal; a plurality of layers of graphite, at least some of which are positioned in close proximity to some of the layers of conductive metal to provide a relatively low resistance path for the flow of heat

A high-frequency multilayer printed circuit, comprising: a plurality of layers of a conductive metal; a plurality of layers of graphite, at least some of which are positioned in close proximity to some of the layers of conductive metal to provide a relatively low resistance path for the flow of heat from the layers of conductive metal; and a plurality of layers of a dielectric material; wherein the layers are bonded together to form a composite multilayer printed circuit board, the layers of graphite being positioned in a symmetrical manner with respect to the thickness of the circuit board and selected in number to provide a multilayer circuit board having a desired coefficient of thermal expansion; and wherein some of the layers of conductive metal are appropriately patterned and combined with other layers of conductive metal and layers of dielectric material to form one or more strip or microstrip transmission lines for electrically connecting very high frequency electronic components mounted on the board.