초록 ▼

A heatshield material comprises a material of low density and high surface area per unit weight. This material is able to fix by chemical means free water molecules. It is also adapted to permit superheating of steam produced from this free water in response to thermal attack. The material is intima

A heatshield material comprises a material of low density and high surface area per unit weight. This material is able to fix by chemical means free water molecules. It is also adapted to permit superheating of steam produced from this free water in response to thermal attack. The material is intimately mixed with at least one non-combustible binder and at least one source of the free water molecules or a substance supplying the free water molecules.

대표청구항 ▼

Heatshield material comprising a material of low density and high surface area per unit weight consisting essentially of silica (SiO2) with chemically stable silanol groups (SiOH) on its surface, said silanol groups being chemically and thermally stable up to 250°C., the surface area per unit weight

Heatshield material comprising a material of low density and high surface area per unit weight consisting essentially of silica (SiO2) with chemically stable silanol groups (SiOH) on its surface, said silanol groups being chemically and thermally stable up to 250°C., the surface area per unit weight of said silica being at least 300 m2/g, said silanol groups fixing chemical reaction free water molecules to permit superheating of steam produced from said free water in response to thermal attack, and at least two substances having a high concentration of chemically-bonded water and supplying said free water molecules at two different temperatures between about 60°and 215°C., one of said substances being decahydrated disodium tetraborate and the other comprising alumina hydrate, intimately mixed with at least one resinous binder.