초록 ▼

The present invention provides a pluggable, high density, reliable integrated circuit package. The package has a plurality of integrated circuit chips mounted on a multilayer ceramic substrate. Input-output signals are provided to the module by means of mating male female input-output pins which are

The present invention provides a pluggable, high density, reliable integrated circuit package. The package has a plurality of integrated circuit chips mounted on a multilayer ceramic substrate. Input-output signals are provided to the module by means of mating male female input-output pins which are located on the bottom of the module. Power is provided to the module from a multilayer ceramic frame through an edge connector that is an integral part of the mulltilayer ceramic substrate. Matching circuit vias located on the edge of the multilayer ceramic substrate and on the edge of the multilayer ceramic frame are cut and tinned with tin-lead to provide power input connections. When the module is plugged into the circuit board the edge connectors on the module mate with the edge connectors in the ceramic frame. Since the frame is made of the same material as the module substrate, the power connectors have excellent thermal match and they are highly reliable.

대표청구항

Apparatus according to claim 7 wherein each of said ends of said conductors of at least one of said first and second members are terminated with a cut conductive via.

Apparatus according to claim 7 wherein each of said ends of said conductors of at least one of said first and second members are terminated with a cut conductive via.