$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Printed circuit devices using thermoplastic resin cover plate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/18
출원번호 US-0057385 (1987-06-02)
우선권정보 JP-0129488 (1986-06-04); JP-0157264 (1986-07-04)
발명자 / 주소
  • Okuaki Hiroshi (Tokyo JPX)
출원인 / 주소
  • Oki Electric Industry Co., Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 76  인용 특허 : 17

초록

A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconductor IC chips are respectively fixedly mounted

대표청구항

A printed circuit device comprising: (a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material; (b) a plurality of semiconductor

이 특허에 인용된 특허 (17)

  1. Newton Edward L. (Tempe AZ) Swendrowski Steven D. (Chander AZ), Carrier for tape automated bonded semiconductor device.
  2. Prosky Howard S. (Arapahoe County CO), Electrical circuit board with directly attached display unit and method of assembling same.
  3. Chee Aik T. (Singapore SGX) Kiat Wee S. (Singapore SGX), Electronic component cap and seal.
  4. Kaneko Fumihiko (Nagaokakyo JPX) Kawamura Takashi (Nagaokakyo JPX) Anao Kimiharu (Nagaokakyo JPX) Shimamaki Keiichi (Nagaokakyo JPX), Electronic component series.
  5. Honda Yukio (Nagaokakyo JPX), Electronic components series.
  6. Nakazawa, Terumi; Minorikawa, Hitoshi; Kawakami, Kazuhiko, Electronic device for automobile.
  7. Miniet Jay J. (Ft. Lauderdale FL), Flexible printed circuit board having integrated circuit die or the like affixed thereto.
  8. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX) Nakano Harumi (Tokyo JPX), IC card.
  9. Mettler ; Jr. Rollin W. (4 Tumblebrook Ct. Cheshire CT 06410), Integrated circuit module and method of making same.
  10. Scapple Robert Y. (Los Angeles CA) Keister Frank Z. (Culver City CA) Grieger Robert G. (Marina Del Rey CA) Himmel Richard P. (Mission Viejo CA), Large area hybrid microcircuit assembly.
  11. Abe Takemi (Fujisawa JPX), Method of manufacturing a semiconductor device.
  12. Parmentier Paul (Cailly-sur-Eure FRX), Method of manufacturing an identification card and an identification manufactured, for example, by this method.
  13. Moser Floyd R. (South Burlington VT) Noth Richard W. (Underhill VT), Method of sealing an electronic module in a cap.
  14. Okuaki Hiroshi (Tokyo JPX), Printed-circuit construction with EPROM IC chip mounted thereon.
  15. Otsuka, Kanji; Mitsusada, Kazumichi; Sekibata, Masao; Ohnishi, Shinji, Semiconductor device including an alpha-particle shield.
  16. Hebert David F. (Hayward CA), Semiconductor package with tape mounted die.
  17. Neumann Edward William (Poughkeepsie NY) Rabenda ; Jr. Edward John (Poughkeepsie NY), Thermally conducting elastomeric device.

이 특허를 인용한 특허 (76)

  1. Yamanaka Hideo,JPX, Air-packed CCD images package and a mold for manufacturing thereof.
  2. Hassan Altaf ; Bhattacharyya Bidyut K., Anchor provisions to prevent mold delamination in an overmolded plastic array package.
  3. Boudreau Robert Addison ; Bowen Terry Patrick ; Han Hongtao ; Tan Songsheng ; Rowlette ; Sr. John Robert, Anodic aluminum oxide passive alignment structures.
  4. Tuttle Mark E. (Boise ID) Lake Rickie C. (Boise ID) Mousseau Joe P. (Boise ID) Cirino Clay L. (Boise ID), Article and method of manufacturing an enclosed electrical circuit using an encapsulant.
  5. Onodera Toshiya (Furukawa JPX), Automatic mounting chip component.
  6. Farrell, Brian; Jaynes, Paul; Taylor, Malcolm, Chip package sealing method.
  7. Osamu Watanabe JP; Junji Kondo JP; Toshihiko Kobayashi JP, Circuit block for power supply.
  8. Floyd Michael Richard ; Oberle Thomas A. ; Prayne Patrick Joseph, Circuit in a selective call radio with improved electromechanical interconnects.
  9. Mazingue-Desailly, Stephan; Mueller, Michael, Circuit module and method for producing such a circuit module.
  10. Stoneham, Edward B.; Gaudette, Thomas M., Circuit structure with multifunction circuit cover.
  11. Derwin Mark Daniel ; Labzentis Daniel Peter ; Reid Jonathan David ; Sharp Timothy Lee, Circuitized substrate with material containment means and method of making same.
  12. Wennemuth, Ingo; Strutz, Volker; Gebauer, Uta, Covering element for subassemblies.
  13. Barrow Michael, Custom corner attach heat sink design for a plastic ball grid array integrated circuit package.
  14. Van Antwerp, William P.; Karre, Sheana; Prokop, Adrian; Stinson, Sara Akiko; Fong, Jason; Rosenberg, James J., Device and method for circuit protection during radiation sterilization.
  15. Arnold,Rocky R.; Zarganis,John C.; Montauti,Fabrizio, EMI shielding for electronic component packaging.
  16. Thomas P. Glenn, Electromagnetic interference shield device with conductive encapsulant and dam.
  17. Gabower,John F., Electromagnetic interference shields for electronic devices.
  18. Farrell,Brian; Jaynes,Paul; Taylor,Malcolm, Electronic and optoelectronic component packaging technique.
  19. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  20. Uchida,Kenji; Hirasawa,Koki; Ohtaka,Tatsuya; Kishino,Kazuhisa; Suzuki,Sachio, Electronic device capable of preventing electromagnetic wave from being radiated.
  21. Onishi Keiji,JPX ; Iwaki Hideki,JPX ; Seki Shun-ichi,JPX ; Taguchi Yutaka,JPX ; Shiraishi Tsukasa,JPX ; Bessho Yoshihiro,JPX ; Kawasaki Osamu,JPX ; Eda Kazuo,JPX, Electronic part and a method of production thereof.
  22. Kober Horst,DEX ; Spiess Karl-Heinz,DEX ; Kosack Steffen,DEX, Flat seal.
  23. Skipor Andrew F. ; Gamota Daniel Roman ; Yeh Chao-Pin ; Wyatt Karl W. ; Zhou Wen Xu, Frame embedded in a polymeric encapsulant.
  24. Glenn Thomas P., Integrated circuit package employing a transparent encapsulant.
  25. Huang, Rui; Do, Byung Tai; Chow, Seng Guan; Kuan, Heap Hoe, Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof.
  26. Plepys Anthony R. ; Harvey Paul M., Laminated integrated circuit package.
  27. Armstrong Joseph H. ; Misra Mohan S. ; Kapuria Anil K., Low cost protective coating and method for a die-on-board electronic assembly.
  28. Upadhyayula, Suresh; Miller, Robert C.; Takiar, Hem; Sprouse, Steven; Yung, Ka Ian, Low profile wire bonded USB device.
  29. Upadhyayula, Suresh; Miller, Robert C.; Takiar, Hem; Sprouse, Steven; Yung, Ka Ian, Low profile wire bonded USB device.
  30. Schelhorn Robert L. (Vincentown NJ), Metallized ceramic circuit package.
  31. Khanna,Vijayeshwar Das; Kuczynski,Joseph; Sinha,Arvind Kumar; Sri Jayantha,Sri M., Method and apparatus for optimizing heat transfer with electronic components.
  32. Felix Mayer CH; Oliver Paul DE, Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly.
  33. Van Antwerp, William P.; Karre, Sheana; Prokop, Adrian; Stinson, Sara Akiko; Fong, Jason; Rosenberg, James J., Method for circuit protection during radiation sterilization.
  34. Lechner,Johannes, Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor.
  35. Glenn, Thomas P., Method of making an electromagnetic interference shield device.
  36. Barrow Michael, Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package.
  37. Tuttle, Mark E.; Tuttle, John R.; Lake, Rickie C., Method of manufacturing an enclosed transceiver.
  38. Murata,Akihiro, Method of manufacturing an optical device.
  39. Grimard, Jean-Christophe, Method to integrate an RFID component in a prosthesis or implant substitute or in a surgical instrument in polymer or plastic.
  40. Karpur, Prasanna; Muthukumar, Sriram, Methods and apparatuses to stiffen integrated circuit package.
  41. Stevens, Blake; Sorenson, Max; Clayson, Paul S.; Gordon, Scott B., Methods for applying protective coatings to internal surfaces of fully assembled electronic devices.
  42. Stevens, Blake; Sorenson, Max; Martin, III, Sidney Edward, Methods for masking and applying protective coatings to electronic assemblies.
  43. Braden Jeffrey S. (Milpitas CA), Multi-layer lead frames for integrated circuit packages.
  44. Shi,Fong, Near hermetic packaging of gallium arsenide semiconductor devices and manufacturing method therefor.
  45. Murata, Akihiro, Optical device and method of manufacture thereof, and electronic instrument.
  46. Vongfuangfoo Sutee ; Bacher Brent ; Sumagaysay Felipe, PBGA stiffener package.
  47. Shimizu Toshio,JPX ; Hiramoto Hiroyuki,JPX ; Sekiya Hiroki,JPX ; Kigima Kenji,JPX, Package for semiconductor power device and method for assembling the same.
  48. Shimizu, Toshio; Hiramoto, Hiroyuki; Sekiya, Hiroki; Kigima, Kenji, Package for semiconductor power device and method for assembling the same.
  49. Long Jon ; McCormick John, Power plane for semiconductor device.
  50. Shin Bo Hyun,KRX ; An Min Cheol,KRX, Printed circuit board and chip-on-board packages using same.
  51. Tuttle, John R., Radio frequency identification device and method.
  52. Astle, David James; Child, Tyler Christensen; Kasagani, Vimal Kumar; Loose, Cameron LaMar; Stevens, Blake LeRoy; Sorenson, Max Ernest, Removal of selected portions of protective coatings from substrates.
  53. Nakajima, Dai; Yoshimatsu, Naoki; Matsuo, Haruyuki; Ishii, Ryuuichi, Semiconductor device.
  54. Lan, Hoang; Zhenliang, Wang, Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material.
  55. Mahler, Joachim; Tang, Seow Mun, Semiconductor device with semiconductor device components embedded in plastic package compound.
  56. Yoon Suck-Jun,KRX, Semiconductor package.
  57. Jeong, Jung Tae, Semiconductor packages including interconnection members.
  58. Hoffman, Paul; Mathews, Doug, Shielded semiconductor leadframe package.
  59. Hoffman, Paul; Mathews, Doug, Shielded semiconductor package with single-sided substrate and method for making the same.
  60. Beals, William Michael; Goupil, Hervé, Smart card interface.
  61. Beals, William Michael; Goupil, Hervé, Smart card interface.
  62. Beals, William Michael; Goupil, Hervé, Smart card interface.
  63. Beals, William Michael; Goupil, Hervé, Smart card interface.
  64. Beals, William Michael; Goupil, Hervé, Smart card interface.
  65. Beals, William Michael; Goupil, Hervé, Smart card interface.
  66. Beals, William Michael; Goupil, Hervé, Smart card interface.
  67. Noda Yuuji,JPX, Structure and method for mounting an electric part.
  68. Tuttle Mark E. ; Lake Rickie C. ; Mousseau Joe P. ; Cirino Clay L., Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an.
  69. Naitoh, Yasuhisa; Horikawa, Masayo; Abe, Hidekazu; Shimizu, Tetsuo; Mizutani, Wataru; Furuta, Shigeo; Ono, Masatoshi; Takahashi, Tsuyoshi, Switching element relying on nanogap electrodes.
  70. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  71. Stevens, Blake; Sorenson, Max; Gordon, Scott B., System for refurbishing or remanufacturing an electronic device.
  72. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  73. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  74. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  75. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
  76. Perrine, Jerome; Goupil, Hervé; van Riek, Maurice Gerard; Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, USB interface for performing transport I/O.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트