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Multilayer printed circuit board for ceramic chip carriers

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/03
출원번호 US-0098260 (1987-09-18)
발명자 / 주소
  • Leibowitz Joseph D. (Culver City CA)
출원인 / 주소
  • TRW Inc. (Redondo Beach CA 02)
인용정보 피인용 횟수 : 26  인용 특허 : 15

초록

A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower therm

대표청구항

A multilayer printed circuit board, comprising: a plurality of layers of a composite material fabricated by lay-up of an armid fiber tape, each composite layer including two outer layers and two inner layers of the aramid fiber tape, the aramid fiber tape being oriented in the X direction in the out

이 특허에 인용된 특허 (15)

  1. Olson Larry D. (Viroqua WI), Chip carrier substrates of hybrid woven glass cloths.
  2. Hsiue Eric S. (Parsippany NJ) Ziatyk Daniel (Denville NJ) Stone George R. (Hopatcong NJ) DeBona Bruce T. (Madison NJ), Circuit board made from cross-linked polycyanurate polymer, thermoplastic polymer and polyaramid fiber.
  3. Leibowitz Joseph D. (Culver City CA), Controlled thermal expansion composite and printed circuit board embodying same.
  4. Bishop, Sarah M.; Curtis, Paul T., Fibre reinforced composites.
  5. Eastes Walter L. (Granville OH) Goldman Don S. (Richland WA), Glass compositions having low expansion and dielectric constants.
  6. Butt Sheldon H. (Godfrey IL), Low thermal expansivity and high thermal conductivity substrate.
  7. Gannett Thomas P. (Wilmington DE) Gibbs Hugh H. (Wilmington DE), Melt-fusible polyimides.
  8. Hanson John R. (Richmond MA) Hauser James L. (Lenox MA) Kilfeather ; Jr. James F. (Pittsfield MA) Hendriks Hendrik B. (Becket MA), Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion.
  9. Ferrari Serge (La Tour du Pin FRX), Method of producing a coated fabric.
  10. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board structure.
  11. Sanjana Zal N. (Penn Hills Township ; Allegheny County PA) Marchetti Joseph R. (Greensburg PA), Polyaramid laminate.
  12. Jensen Warren M. (Kirkland WA), Printed wiring board substrates for ceramic chip carriers.
  13. Jensen Warren M. (Kirkland WA) Wilkinson William C. (Redmond WA), Thermally conductive printed wiring board laminate.
  14. Terpay John M. (Danville VA), Woven fabrics containing glass fibers and abrasive belts made from same.
  15. Palmer Raymond J. (Newport Beach CA) Micheaux Dominique (Villette d\Anthon FRX), Woven material and layered assembly thereof.

이 특허를 인용한 특허 (26)

  1. Middelman Erik (Arnhem NLX), Continuous process for the manufacture of substrates for printed wire boards.
  2. Fjelstad,Joseph C.; Segaram,Para K.; Haba,Belgacem, Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths.
  3. Fjelstad, Joseph C.; Segaram, Para K.; Haba, Belgacem, Direct-connect signaling system.
  4. Min, Gui-Nam, Display device.
  5. Fjelstad, Joseph C.; Grundy, Kevin P.; Yasumura, Gary, IC package structures having separate circuit interconnection structures and assemblies constructed thereof.
  6. Nagai Akira,JPX ; Ogata Masatsugu,JPX ; Eguchi Shuji,JPX ; Ogino Masahiko,JPX ; Ishii Toshiaki,JPX ; Segawa Masanori,JPX ; Kokaku Hiroyoshi,JPX ; Moteki Ryo,JPX ; Anjoh Ichiro,JPX, Laminate and multilayer printed circuit board.
  7. Japp Robert M. ; Poliks Mark D., Low CTE power and ground planes.
  8. Harazono, Masaaki; Matsumoto, Toshihiro, Method and apparatus for manufacturing prepreg sheet and prepreg sheet.
  9. Japp, Robert M.; Poliks, Mark D., Method for making printed circuit board having low coefficient of thermal expansion power/ground plane.
  10. Middelman Erik,NLX, Method of making a composite laminate and a PWB substrate so made.
  11. Middelman Erik (Arnhem NLX) Zuuring Pieter Hendrik (Nijmegen NLX), Method of manufacturing a UD-reinforced PWB laminate.
  12. Sohn, Keungjin; Ikeguchi, Nobuyuki; Ryu, Joung-Gul; Park, Ho-Sik; Lee, Sang-Youp; Shin, Joon-Sik; Park, Jung-Hwan, Method of manufacturing and insulating sheet.
  13. Fjelstad, Joseph C.; Haba, Belgacem, Multi-path via interconnection structures and methods for manufacturing the same.
  14. Koya Kenji,JPX, Multilayer printed circuit board.
  15. Shigeo Amagi JP; Satoshi Murakawa JP, Multilayer printed wiring board and electronic equipment.
  16. Okazaki, Toru, Multilayered wiring board.
  17. Paquette Edward L. (Claremont CA) Riley William C. (Palos Verdes Estates CA) Taparauskas Paul A. (Solana Beach CA) Warren James W. (Woodland Hills CA), Printed circuit board with inorganic insulating matrix.
  18. Koh Wei NMI ; Louie Wesley J., Process of vacuum annealing a thin film metallization on high purity alumina.
  19. Ibe Hiromitu (Kosai JPX) Shirai Yoshimichi (Toyoake JPX) Ura Takaharu (Kosai JPX), Rotor for printed-wiring motor.
  20. Katz Walter M., Routable high-density interfaces for integrated circuit devices.
  21. Katz, Walter M., Routable high-density interfaces for integrated circuit devices.
  22. Hsieh, George; Dishongh, Terrance J.; Dixon, Scott, Selective PCB stiffening with preferentially oriented fibers.
  23. Hsieh,George; Dishongh,Terrance J.; Dixon,Scott, Selective PCB stiffening with preferentially oriented fibers.
  24. Baillin, Xavier, Structure comprising a getter layer and an adjusting sublayer and fabrication process.
  25. Baillin, Xavier, Structure comprising a getter layer and an adjusting sublayer and fabrication process.
  26. Fjelstad,Joseph C.; Segaram,Para; Obenhuber,Thomas; Yasumura,Gary, System for making high-speed connections to board-mounted modules.
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