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A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins an

A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

대표청구항 ▼

The process of forming an integrated circuit pin grid array package, comprising the steps of: (a) providing an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; (b) forming a plura

The process of forming an integrated circuit pin grid array package, comprising the steps of: (a) providing an interconnect tape defining a metal interconnect circuit pattern, said tape having first and second opposing surfaces, said circuit pattern defining a plurality of leads; (b) forming a plurality of holes in said metal circuit pattern; (c) providing a plurality of terminal pins; (d) disposing said interconnect tape into a mold: (e) either before or after step (d) a terminal pin through each of said holes whereby said terminal pins extend outward from both the first and second opposing surfaces of said interconnect tape; (f) closing the mold so that a cavity is formed about said terminal pins and said tape; and (g) molding a polymer resin about said pins and tape to at least partially surround and support said terminal pins and tape, said molding step comprising filling the cavity with said polymer resin.