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System for surface and fluid cleaning

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/10
출원번호 US-0030895 (1987-03-26)
발명자 / 주소
  • Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN)
출원인 / 주소
  • Regents of the University of Minnesota (Minneapolis MN 02)
인용정보 피인용 횟수 : 75  인용 특허 : 4

초록

A cleaning system of the apparatus utilizing the effect of surface tension forces (4) and phase changes between a liquid and gas. In one embodiment the surface (21) to be cleaned is submerged within a vessel (30), the pressure within the vessel being increased. A rapid depressurization of the vessel

대표청구항

A system for cleaning a surface, comprising: (a) a pressure vessel, the pressure vessel being suitably configured so as to house the surface; (b) a cleaning fluid within the pressure vessel of sufficient depth such that the surface is submerged in the cleaning fluid; (c) means for introducing a gas

이 특허에 인용된 특허 (4)

  1. Dougherty Francis J. (Jenkintown PA), Cleaning apparatus.
  2. Bender Hans (Leverkusen DEX) Graf Rupprecht (Cologne DEX) Unkelbach Karl-Heinz (Cologne DEX) Zabel Wolf (Seelscheid DEX), Method and apparatus for cleaning a matrix of a wet magnetic separator.
  3. Baran Walter J. (Erie PA), System providing for decontamination washing and/or biocidal treatment.
  4. Shirai Mitugu (Hadano JPX) Sasaki Hideaki (Hadano JPX) Ueda Sadatoshi (Chiba JPX) Sawada Akira (Fujisawa JPX), Vapor tank.

이 특허를 인용한 특허 (75)

  1. Fishkin Boris ; Brown Kyle A., Aerosol substrate cleaner.
  2. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  3. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  4. Bergman, Eric J.; Hess, Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  5. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Apparatus and system for cleaning a substrate.
  6. Brandt Werner V. ; Bowers Charles W., Apparatus for cleaning and testing precision components of hard drives and the like.
  7. Abe Tatsuo,JPX ; Suzuki Makoto,JPX, Apparatus for etching wafer.
  8. Bergman, Eric J., Apparatus for treating a workpiece with steam and ozone.
  9. de Larios, John M.; Owczarz, Aleksander; Schoepp, Alan; Redeker, Fritz, Apparatuses and methods for cleaning a substrate.
  10. de Larios,John M.; Owczarz,Aleksander; Schoepp,Alan; Redeker,Fritz, Apparatuses and methods for cleaning a substrate.
  11. Gray, Donald J.; Frederick, Charlotte, Aqueous cleaning of liquid residue by etching.
  12. Charles James Bryer ; Daniel P. Bexten ; Jerry R. Norby, Cleaning apparatus.
  13. Rayandayan,Ronald; Verhaverbeke,Steven; Wang,Hong, Cleaning method and solution for cleaning a wafer in a single wafer process.
  14. Verhaverbeke, Steven; Truman, J. Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  15. Verhaverbeke,Steven; Truman,J. Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  16. Verhaverbeke,Steven; Truman,Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  17. Zhou Dashun Steve ; Beilin Solomon I. ; Roman James J., Cleaning method using ammonium persulphate to remove slurry particles from CMP substrates.
  18. Becker David Scott ; Hanestad Ronald J. ; Thomes Gregory P. ; Weygand James F. ; Zimmerman Larry D., Eliminating stiction with the use of cryogenic aerosol.
  19. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  20. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  21. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-Newtonian fluids.
  22. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-newtonian fluids.
  23. Zhu, Ji; Mendiratta, Arjun; Mui, David, Method and apparatus for removing contaminants from substrate.
  24. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Method and apparatus for removing contamination from substrate.
  25. de Larios,John M.; Ravkin,Mike; Parks,John; Korolik,Mikhail; Redeker,Fred C., Method and apparatus for transporting a substrate using non-Newtonian fluid.
  26. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and material for cleaning a substrate.
  27. Korolik, Mikhail; Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz, Method and system for using a two-phases substrate cleaning compound.
  28. Christenson Kurt K., Method and system to control the concentration of dissolved gas in a liquid.
  29. Jolley, Michael, Method for cleaning copper surfaces.
  30. Bergman, Eric J.; Hess, Mignon P., Method for processing the surface of a workpiece.
  31. Korolik, Mikhail; Ravkin, Michael; deLarios, John; Redeker, Fritz C.; Boyd, John M., Method for removing material from semiconductor wafer and apparatus for performing the same.
  32. Steven L. Nelson ; Kurt K. Christenson, Method for treating a substrate with heat sensitive agents.
  33. Murakami Shinya,JPX ; Kamikawa Yuuji,JPX ; Izumi Sinichiro,JPX ; Anai Noriyuki,JPX ; Satoh Takami,JPX ; Shiraishi Hirofumi,JPX ; Harada Koji,JPX ; Tomoeda Takayuki,JPX ; Tanaka Hiroshi,JPX, Method for washing objects.
  34. Karl M. Robinson, Method of cleaning mixed material surfaces.
  35. Farrar, Paul A., Method of cleaning semiconductor surfaces.
  36. Farrar, Paul A., Method of cleaning semiconductor surfaces.
  37. Farrar,Paul A., Method of cleaning semiconductor surfaces.
  38. Brask,Justin K.; Block,Bruce A., Method of smoothing waveguide structures.
  39. Nelson, Steven L.; Christenson, Kurt K., Method to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized.
  40. Steven L. Nelson ; Kurt K. Christenson, Method to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized.
  41. Patel,Bakul P.; Cernat,Mihaela; Small,Robert J., Methods for chemically treating a substrate using foam technology.
  42. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  43. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  44. Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz; de Larios, John M.; Freer, Erik M.; Korolik, Mikhail, Methods for contained chemical surface treatment.
  45. Bergman, Eric J., Methods for processing a workpiece using steam and ozone.
  46. Bergman,Eric J., Methods of thinning a silicon wafer using HF and ozone.
  47. Custer, Dan G.; Ward, Aaron Trent; Lewis, Shawn M., Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces.
  48. Custer Dan G. ; Ward Aaron Trent ; Lewis Shawn M., Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes.
  49. Custer Dan G. ; Ward Aaron Trent ; Lewis Shawn M., Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes.
  50. Custer, Dan G.; Ward, Aaron Trent; Lewis, Shawn M., Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes.
  51. Wandres, Claus G, Process and apparatus for removing impurities from surfaces contaminated with liquid.
  52. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
  53. Gebhart,Thomas Maximilia; Bergman,Eric J., Process and apparatus for treating a workpiece using ozone.
  54. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
  55. Rose Peter H. ; Sferlazzo Piero, Processing a surface.
  56. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
  57. Freer, Erik M.; de Larios, John M.; Ravkin, Michael; Korolik, Mikhail; Mikhaylichenko, Katrina; Redeker, Fritz C., Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions.
  58. Higuchi, Ayumi; Arai, Kenichiro, Substrate processing apparatus and method of removing particles.
  59. Miya, Katsuhiko, Substrate processing apparatus and substrate processing method.
  60. Miya, Katsuhiko; Fujiwara, Naozumi; Izumi, Akira, Substrate processing apparatus, liquid film freezing method and substrate processing method.
  61. Izumi, Akira, Substrate processing method and substrate processing apparatus.
  62. Kato, Masahiko; Fujiwara, Naozumi; Miya, Katsuhiko, Substrate processing method and substrate processing apparatus.
  63. Miya, Katsuhiko; Fujiwara, Naozumi, Substrate processing method and substrate processing apparatus.
  64. Matsubara,Hideaki, Substrate processing method of and substrate processing apparatus for freezing and cleaning substrate.
  65. Moriya, Tsuyoshi; Nagaseki, Kazuya, Substrate processing system, substrate processing method, and storage medium.
  66. Kittle Paul A., Surface treatment of semiconductor substrates.
  67. Kittle Paul A., Surface treatment of semiconductor substrates.
  68. Kittle, Paul A., Surface treatment of semiconductor substrates.
  69. Paul A. Kittle, Surface treatment of semiconductor substrates.
  70. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
  71. Roth, Wayne D.; Collins, Charles J.; Arab, Nicolas F.; Conner, Donald A.; Roach, Robert S.; Smith, David L., Systems and methods for performing measurements of one or more materials.
  72. Roth, Wayne D.; Collins, Charles J.; Deicher, William R.; Krager, Jarden E.; Schilffarth, Adam R.; Johnson, Ross G.; Bozarth, Colin D.; Selvaraj, Victor; Arab, Nicolas F.; Bernard, Bruce J. C.; Conner, Donald A.; Roach, Robert S., Systems and methods for performing measurements of one or more materials.
  73. Patrin John C. ; Heitzinger John M., Treating substrates by producing and controlling a cryogenic aerosol.
  74. Robinson Karl M., Wet cleans for composite surfaces.
  75. Robinson Karl M., Wet cleans for composite surfaces.
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