초록 ▼

A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surf

A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.

대표청구항 ▼

A carrier for semiconductor device, comprising; a plug-in type package having one or more semiconductor chips packaged therein; said plug-in type package comprising a flexible printed wiring substrate, electrically conductive terminals attached to said substrate, a heat sink for semiconductor attach

A carrier for semiconductor device, comprising; a plug-in type package having one or more semiconductor chips packaged therein; said plug-in type package comprising a flexible printed wiring substrate, electrically conductive terminals attached to said substrate, a heat sink for semiconductor attachment, and a surrounding package body, said substrate comprising an insulating film or this sheet with an opening and a plurality of through holes for terminal attachment, and printed wirings of conductor patterns formed on one or both sides of said insulating film or thin sheet; said terminals each having a collar portion, and each being inserted at its head portion into a respective through hole of the substrate so that said collar is in contact with said substrate, said terminals being electrically connected at said head or collar portions to the respective conductor patterns on the substrate; said heat sink being fixedly attached to said substrate so as to close the opening of said substrate, and said substrate, head and collar portions of said terminals and said heat sink being encapsulated in said package body so that one surface of said heat sink is exposed from one side of the package body.