초록 ▼

Novel directly solderable three-dimensional electrically conductive circuit components are made by forming firmly adherent metal coatings on smooth thermoplastic substrates, e.g., polyether imides, by sputtering the metal directly onto the substrate, without any surface preparation or treatment of t

Novel directly solderable three-dimensional electrically conductive circuit components are made by forming firmly adherent metal coatings on smooth thermoplastic substrates, e.g., polyether imides, by sputtering the metal directly onto the substrate, without any surface preparation or treatment of the substrate, under sputtering conditions which cause at least a portion of the sputtered metal, e.g., copper, to be imbedded into and below the substrate surface. Another metal coating can be provided by sputtering, or electro or electroless deposition over the sputter-deposited coating.

대표청구항 ▼

An article of manufacture comprising: (I) a molded, solderable, thermoplastic resin substrate having at least two smooth surfaces; (II) a firmly adherent and substantially uniform layer of at least one conductive metal deposited in a selected circuit pattern on at least one of said surfaces by sputt

An article of manufacture comprising: (I) a molded, solderable, thermoplastic resin substrate having at least two smooth surfaces; (II) a firmly adherent and substantially uniform layer of at least one conductive metal deposited in a selected circuit pattern on at least one of said surfaces by sputtering; and, optionally, (III) 0% to 70% of a reinforcement contained in the substrate.