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특허 상세정보

Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for c

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B05D-001/02   
미국특허분류(USC) 427/422 ; 427/100 ; 427/427 ; 239/1022
출원번호 US-0117007 (1987-11-04)
우선권정보 DE-3637631 (1986-11-05)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 75  인용 특허 : 3
초록

In a method of applying small quantities of melted solder from a nozzle to surfaces to be wetted, which are then solidified, the solder is caused to melt by heating and is propelled by means of a piezoelectric transducer used as a pressure generator from a delivery nozzle in the form of droplets onto the area to be wetted.

대표
청구항

A method of applying small drop-shaped quantities of melted solder from a nozzle of a suitable conduit to surfaces to be wetted which quantities are then solidified to connections of components, wherein said solder is melted in said conduit and maintained melted in said conduit by heating said conduit, said melted solder being propelled by means of a piezolectric transducer used as a pressure generator from said nozzle in the form of droplets onto the surfaces to be wetted.

이 특허를 인용한 특허 피인용횟수: 75

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