초록 ▼

Disclosed is a flow sensor housing comprising a base member having a flow channel formed therein. The base member comprises means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor. The base member compris

Disclosed is a flow sensor housing comprising a base member having a flow channel formed therein. The base member comprises means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor. The base member comprises the body of a standard semiconductor package. Standard semiconductor package conductors are integral to the base member. Each conductor has first and second terminal portions. The conductors and terminal portions are positioned so that the first terminal portion of a plurality of conductors are each adapted to connect to a higher level package adapted for receiving a standard semiconductor package and so that the second terminal portion of a plurality of conductors are each adapted for electrical connection to the flow sensor.

대표청구항 ▼

A flow sensor housing comprising: a base member having a flow channel formed therein, the base member comprising means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor, the base member comprising the bod

A flow sensor housing comprising: a base member having a flow channel formed therein, the base member comprising means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor, the base member comprising the body of a standard semiconductor package; and standard semiconductor package conductors integral to the base member, each conductor having first and second terminal portions, the conductors and terminal portions being positioned so that the first terminal portion of a plurality of conductors are each adapted to connect to a higher level package adapted for receiving a standard semiconductor package and so that the second terminal portion of a plurality of conductors are each adapted for electrical connection to the flow sensor.