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An explosive detonator consisting of an integrated circuit chip having a silicon substrate on which is formed an amorphous or polysilicon bridge, the bridge extending between two metal wire-bonding pads also on the substrate. The integrated circuit chip is disposed in close proximity to a primary ch

An explosive detonator consisting of an integrated circuit chip having a silicon substrate on which is formed an amorphous or polysilicon bridge, the bridge extending between two metal wire-bonding pads also on the substrate. The integrated circuit chip is disposed in close proximity to a primary charge such that when the bridge is energized by an electric current, it heats to the point where the charge is ignited. By back-etching the silicon substrate under the bridge, parasitic heat conduction is avoided. Further, by bonding a pyrex tube to the chip with the tube\s bore surrounding the bridge, it is possible to pack the bore with an explosive train in fabricating the detonator assembly.

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A detonator comprising: (a) a silicon chip having first and second major surfaces; (b) a nitride layer formed on said first major surface; (c) a strip of silicon disposed atop said nitride layer; (d) first and second metal pads deposited on opposed end portions of said silicon strip; (e) means for h

A detonator comprising: (a) a silicon chip having first and second major surfaces; (b) a nitride layer formed on said first major surface; (c) a strip of silicon disposed atop said nitride layer; (d) first and second metal pads deposited on opposed end portions of said silicon strip; (e) means for holding a primary explosive in intimate contact with said silicon strip; and (f) means for applying electrical energy to said silicon strip, via said first and second metal pads for generating sufficient heat to detonate said primary explosive.