초록 ▼

A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by s

A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be inspected by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.

대표청구항 ▼

The process of claim 5 wherein said cutting step is accomplished by sawing using a saw blade that is thin relative to the saw blade employed in said forming step. The process for forming a closure seal in a hermetic ceramic package composed of high alumina ceramic body having a recess in a face ther

The process of claim 5 wherein said cutting step is accomplished by sawing using a saw blade that is thin relative to the saw blade employed in said forming step. The process for forming a closure seal in a hermetic ceramic package composed of high alumina ceramic body having a recess in a face thereof for containing an electronic device, said recess being surrounded by a metallization ring formed on said face, said process comprising the steps: forming a high alumina ceramic cap having a peripheral recess in one face thereof; forming a layer of metallization on said face of said cap wherein said recess is covered with said metallization; applying a solder preform to said ceramic body in registry with said metallization ring; placing said lid on said solder preform so that said metallization on said lid face contacts said solder preform; and firing said body with said solder preform and said lid in place so that said solder melts and secures said lid to said body to complete a hermetic seal.