초록 ▼

An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lo

An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

대표청구항 ▼

A method for providing a packaged electronic device having a carrier structure comprising the steps of: providing a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from th

A method for providing a packaged electronic device having a carrier structure comprising the steps of: providing a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from the bonding area and an intermediate portion between the proximal end and the distal end; bonding an electronic element to the proximal ends of leads in the lead frame; providing a package body over the electronic element and at least a portion of the proximal ends of each of the leads, the package body being a first material; and providing a carrier structure over and adherent to at least a portion of the distal ends of at least some of the leads, the carrier structure being of a second material different from the first material; at least a portion of the intermediate portions of the leads being exposed and not covered by either material. The method of claim 10 wherein the step of providing a carrier structure provides a carrier structure that at least partially encircles the package body.