초록 ▼

A ceramic semiconductor package suitable for high frequency operation includes internal and external ground planes formed on opposite faces of a ceramic base member. The internal ground plane is connected to a ground ring formed on the packaged semiconductor device, and both ground planes are interc

A ceramic semiconductor package suitable for high frequency operation includes internal and external ground planes formed on opposite faces of a ceramic base member. The internal ground plane is connected to a ground ring formed on the packaged semiconductor device, and both ground planes are interconnected about the periphery of the package. In this way, a uniform and continuous ground is provided to minimize variations in signal transmission line impedance.

대표청구항 ▼

A ceramic semiconductor package comprising: a ceramic base having parallel faces and a peripheral edge between said faces, wherein a first of said faces includes a site for attaching a semiconductor device; an internal ground plane formed on said first of said faces and extending substantially from

A ceramic semiconductor package comprising: a ceramic base having parallel faces and a peripheral edge between said faces, wherein a first of said faces includes a site for attaching a semiconductor device; an internal ground plane formed on said first of said faces and extending substantially from the attachment site to the peripheral edge; an external ground plane formed on a second of said faces and covering substantially the entire area thereof; means for electrically connecting the internal ground plane and the external ground plane, said means including a plurality of conductors evenly spaced about the periphery of the base and extending between said first and second faces; a ceramic spacing layer over the internal ground plane on the first face of the ceramic base; a plurality of signal transmission lines formed over the ceramic spacing layer; a ceramic isolation layer formed over the ceramic spacing layer and filling spaces between adjacent conductors; and a cover layer.