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Method for making multi-layer and pin grid arrays 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03B-019/09
출원번호 US-0147596 (1988-01-22)
발명자 / 주소
  • Pryor Michael J. (Woodbridge CT)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 4  인용 특허 : 29

초록

The process of constructing a multi-layer glass-ceramic circuit is disclosed. One or more glass-ceramic substrates is formed from a slurry or molten glass particles and ceramic which was formed at a temperature wherein the glass particles are molten and the ceramic particles are solid. After an elec

대표청구항

The process of forming a structure from a ceramic and glass composite, said process comprising the steps of: providing particles of ceramic material; providing particles of glass material; mixing said particles of glass and ceramic together to form a mixture of ceramic and glass particles; heating s

이 특허에 인용된 특허 (29)

  1. Butt Sheldon H. (Godfrey IL) Smith ; III Edward F. (Madison CT) Gyurina F. Dennis (West Haven CT), Adhesion primers for encapsulating epoxies.
  2. Butt Sheldon H. (Godfrey IL), Casing for an electrical component having improved strength and heat transfer characteristics.
  3. Butt Sheldon H. (Godfrey IL) Smith ; III Edward F. (Madison CT) Gyurina F. Dennis (West Haven CT), Casing for electronic components.
  4. Winter Joseph (New Haven CT) Brenneman William (Cheshire CT) Fister Julius C. (Hamden CT), Composite material.
  5. Breedis John F. (Trumbull CT) Fister Julius C. (Hamden CT), Composite material having improved bond strength.
  6. Butt Sheldon H. (Godfrey IL), Composites of glass-ceramic to metal seals and method of making the same.
  7. Breedis John F. (Trumbull CT) Fister Julius C. (Hamden CT), Copper alloys for suppressing growth of Cu-Al intermetallic compounds.
  8. Fister Julius C. (Hamden CT) Breedis John F. (Trumbull CT), Electrical component forming process.
  9. Fister Julius C. (Hamden CT) Breedis John F. (Trumbull CT), Electrical component forming process.
  10. Popplewell James M. (Guilford CT), Glass or ceramic-to-metal composites or seals involving iron base alloys.
  11. Kumar Ananda H. (Wappingers Falls NY) McMillan Peter W. (Leamington Spa NY GB2) Tummala Rao R. (Wappingers Falls NY), Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper.
  12. Kumar Ananda H. (Wappingers Falls NY) McMillan Peter W. (Warwick NY GB2) Tummala Rao R. (Wappingers Falls NY), Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper.
  13. Butt Sheldon H. (Godfrey IL), Hermetically sealed metal package.
  14. Butt Sheldon H. (Godfrey IL), Hermetically sealed semiconductor casing.
  15. Butt, Sheldon H., High density packages.
  16. Butt Sheldon H. (Godfrey IL), Low thermal expansivity and high thermal conductivity substrate.
  17. Mehrabian Robert (Arlington MA) Flemings Merton C. (Cambridge MA), Metal composition and methods for preparing liquid-solid alloy metal compositions and for casting the metal compositions.
  18. Butt Sheldon H. (Godfrey IL), Method of assembling a chip carrier.
  19. Winter Joseph (New Haven CT) Brenneman William (Cheshire CT) Fister Julius C. (Hamden CT), Method of forming a composite material.
  20. Breedis John F. (Trumbull CT) Fister Julius C. (Hamden CT), Method of forming a composite material having improved bond strength.
  21. Fister Julius C. (Hamden CT), Method of making a strip for an electrical contact terminal.
  22. Butt Sheldon H. (Godfrey IL), Method of making low thermal expansivity and high thermal conductivity substrate.
  23. Butt Sheldon H. (Godfrey IL), Method of making semiconductor casing.
  24. Yamada Seiichi (Machida JPX) Kamehara Nobuo (Machida JPX) Hashimoto Kaoru (Yamato JPX) Yokoyama Hiromitsu (Yokohama JPX) Niwa Koichi (Tama JPX) Murakawa Kyohei (Yokohama JPX), Multilayer circuit boards.
  25. Narken Bernt (Poughkeepsie NY) Tummala Rao R. (Wappingers Falls NY), Multilayered glass-ceramic substrate for mounting of semiconductor device.
  26. Butt Sheldon H. (Godfrey IL), Reinforced glass composites.
  27. Butt Sheldon H. (Godfrey IL), Semiconductor casing.
  28. Butt Sheldon H. (Godfrey IL), Semiconductor packages.
  29. Butt Sheldon H. (Godfrey IL), Tape packages.

이 특허를 인용한 특허 (4)

  1. Toyoda Osamu,JPX ; Betsui Keiichi,JPX ; Tokai Akira,JPX ; Kawano Hironobu,JPX, Method of forming barrier ribs for display panels.
  2. Mahulikar Deepak (Madison CT) Tyler Derek E. (Cheshire CT) Braden Jeffrey S. (Livermore CA) Popplewell James M. (Guilford CT), Molded plastic semiconductor package including heat spreader.
  3. Lavallee, Guy P.; Catchmark, Jeffrey M., Optical, optoelectronic and electronic packaging platform, module using the platform, and methods for producing the platform and the module.
  4. Norman Kimball J. ; Pratt Dan W., Shaped charge liner and method of manufacture.
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