초록 ▼

A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The

A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The load lock is equipped to remove and replace wafers from a vacuum-sealed wafer carrier. The wafers remain face-down and under hard vacuum during all the wafer handling steps.

대표청구항 ▼

A method for fabricating integrated circuits, comprising the steps of: providing a plurality of wafers in a vacuum sealable wafer carrier box; placing said wafer carrier box into a vacuum sealable load lock attached to a process module; pumping down said load lock to a hard vacuum; opening said wafe

A method for fabricating integrated circuits, comprising the steps of: providing a plurality of wafers in a vacuum sealable wafer carrier box; placing said wafer carrier box into a vacuum sealable load lock attached to a process module; pumping down said load lock to a hard vacuum; opening said wafer carrier and extending a load lock transfer arm into said wafer carrier, to remove a selected one of said wafers therefrom; transferring wafers in a desired sequence from said wafer carrier to one or more selected process stations inside said process module and back until a desired sequence of processing operations has been completed; and then closing said wafer carrier and raising the pressure of said load lock to approximately atmospheric, so that said wafers remain in vacuum inside said wafer carrier while said door of said wafer carrier is held closed by differential pressure.