초록 ▼

A carrier and test device for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20′) or formed leads (20), a cover (60), flexible materials (66), such as an elastomeric, disposed between the cover (60) and

A carrier and test device for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20′) or formed leads (20), a cover (60), flexible materials (66), such as an elastomeric, disposed between the cover (60) and base (30) surfaces, and a means (40, 44, 68) for maintaining pressure across the cover (60) and base (30). The leads (22) of the integrated circuit package (20, 20′) are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) by the securing means (40, 44, 68). The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier and test device (10) for each lead of the integrated circuit package while providing a means to test the IC package while in the carrier and test device (10).

대표청구항 ▼

A carrier for an integrated circuit package having protruding leads, said carrier comprising: a base suitable for receiving the integrated circuit package such that the leads extend over base support surfaces having openings therethrough; a cover having surfaces in alignment with said base support s

A carrier for an integrated circuit package having protruding leads, said carrier comprising: a base suitable for receiving the integrated circuit package such that the leads extend over base support surfaces having openings therethrough; a cover having surfaces in alignment with said base support surfaces; elastomeric connector material disposed in said openings in said base support surfaces and extending therethrough; and means for maintaining pressure across said cover and base; whereby the leads of an integrated circuit package suitably disposed between said base and said cover are secured in position by the elastomeric connector material which forms itself partially around each of the leads in response to the pressure across said base and said cover and the elastomeric material protruding from the bottom of said base is adapted for use in electrical testing of the integrated circuit.