초록 ▼

A shock absorbing type footwear having a buffer part which is provided at a specified position of a sole, said buffer part having a buffer layer made of a gelled material and at least one space formed adjacent to this buffer layer to absorb deformation of the buffer layer. Said buffer layer can be m

A shock absorbing type footwear having a buffer part which is provided at a specified position of a sole, said buffer part having a buffer layer made of a gelled material and at least one space formed adjacent to this buffer layer to absorb deformation of the buffer layer. Said buffer layer can be made to have either a continuous surface or at least two independent segments. Said buffer layer is provided below a flexible covering member which entirely covers the buffer layer and the space to absorb a shock which is caused upon each step of a foot and applied to the covering member.

대표청구항 ▼

A shock absorbing type footwear comprising a covering part which covers a human foot, a sole having, at its toe part, at least one buffer part comprising (a) a buffer layer made of a gelled material, (b) at least one space which is provided adjacent to the side of said buffer layer to absorb expansi

A shock absorbing type footwear comprising a covering part which covers a human foot, a sole having, at its toe part, at least one buffer part comprising (a) a buffer layer made of a gelled material, (b) at least one space which is provided adjacent to the side of said buffer layer to absorb expansion and deformation of said buffer layer in a horizontal direction, (c) a peripheral wall for forming a space which surrounds said buffer layer and said space, (d) semi-hard plates arranged at both upper and lower sides of said buffer layer, (e) a covering member made of a flexible material to cover the surface of the upper one of said semi-hard plates, and (f) a hard plate which is superposed on the underside of the lower semi-hard plate of said semi-hard plates, and at least one pin which is fixed on the underside of the toe part of said sole so that it is positioned below the hard plate of said buffer part, wherein a shock conducted from said pin is dispersedly conducted to said buffer layer by said hard plate.