초록 ▼

Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate preci

Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate precisely configured metal posts which serve as such interconnections.

대표청구항 ▼

A layered, integrated circuit assembly, comprising: a substrate having a planar major surface; electrical conductors lying on said major surface; elongated metal posts which have a first end connected to said conductors and which extend therefrom substantially perpendicular to said major surface; ea

A layered, integrated circuit assembly, comprising: a substrate having a planar major surface; electrical conductors lying on said major surface; elongated metal posts which have a first end connected to said conductors and which extend therefrom substantially perpendicular to said major surface; each of said metal posts having a second end which lies above said surface; a semiconductor device connected to said second end of said metal posts; said semiconductor device and said substrate being made of materials that expand and contract at different rates when they are subjected to temperature changes; and each of said metal posts having a length-to-width ratio which exceeds that which is possible for a metal bump of the same length; said posts being relatively flexible in comparison to said metal bumps and of the same length and operating to accommodate said different expansion rates without overstressing said semiconductor device.