$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for controlling the temperature of an integrated circuit package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
  • F25B-029/00
  • H01L-023/28
출원번호 US-0148819 (1988-01-27)
발명자 / 주소
  • Peters Alfred C. (Garland TX)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 67  인용 특허 : 2

초록

A thermoelectric heat pump is used to maintain the temperature of an integrated circuit under test. Temperature sensors placed on two sides of the integrated circuit measure and generate signals indicative of the temperature at the two surfaces, and the average of the two measured temperatures is co

대표청구항

An apparatus for controlling the temperature of an integrated circuit device and maintaining said integrated circuit device at a preset temperature, comprising; a variable temperature device adjacent said integrated circuit, two temperature sensing devices mounted on two sides of the integrated circ

이 특허에 인용된 특허 (2)

  1. Kawada Kijyu (Atsugi JPX) Ikeda Nobuyuki (Hatano JPX), Apparatus for controlling heat deformation of a turret punch.
  2. Perchak Robert M. (Dayton OH), Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing.

이 특허를 인용한 특허 (67)

  1. Olsen, Douglas S.; Stura, David, Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode.
  2. Olsen, Douglas S.; Stura, David, Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode.
  3. Nickum Larry A., Apparatus for cooling an electronic device.
  4. Sauciuc,Ioan; Chrysler,Gregory M., Application and removal of thermal interface material.
  5. Bell, Lon E.; LaGrandeur, John; Davis, Stephen, Battery thermal management system including thermoelectric assemblies in thermal communication with a battery.
  6. Wong, Wei Ping; Chiew, Chee Keong; Lee, Kok Hua, Burn-in system for electronic devices.
  7. Gawthrop, Peter R., Climate control method for hybrid vehicles using thermoelectric devices.
  8. Gawthrop, Peter R., Climate control system for vehicles using thermoelectric devices.
  9. Sauciuc,Ioan; Chrysler,Gregory M.; Mahajan,Ravi V., Computer system having controlled cooling.
  10. McConville, Paul J.; Lefevre, Jason M.; Moore, Steven R.; Herrmann, Douglas K., Cooling control system.
  11. Vandersande Ian W. ; Ewell Richard ; Fleurial Jean-Pierre ; Lyon Hylan B., Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices.
  12. Cardella Mark A., Cooling system and method of cooling electronic devices.
  13. Ono, Haruyoshi, Device and method for controlling temperature of semiconductor module.
  14. Tozuka Tadao,JPX ; Suzuki Kozo,JPX, Electronic cooling apparatus.
  15. Goenka, Lakhi N.; Crane, Douglas T.; Bell, Lon E., Energy management system for a hybrid-electric vehicle.
  16. Goenka, Lakhi N.; Crane, Douglas T.; Bell, Lon E., Energy management system for a hybrid-electric vehicle.
  17. Pippin,Jack D., Fail-safe thermal sensor apparatus and method.
  18. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
  19. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
  20. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
  21. Corbin, Jr.,John Saunders; Garza,Jose Arturo; Kent,Dales Morrison; Larsen,Kenneth Carl; Mahaney, Jr.,Howard Victor; Phan,Hoa Thanh; Salazar,John Joseph, Functional and stress testing of LGA devices.
  22. Goenka, Lakhi Nandlal; Bell, Lon Edward, HVAC system for a vehicle.
  23. LaGrandeur, John; Bell, Lon E., Heater-cooler with bithermal thermoelectric device.
  24. Ghoshal Uttam Shyamalindu, Highly reliable thermoelectric cooling apparatus and method.
  25. Goenka, Lakhi Nandlal, Hybrid vehicle temperature control systems and methods.
  26. Pippin,Jack D., Method and apparatus for programmable thermal sensor for an integrated circuit.
  27. Burward-Hoy Trevor, Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment.
  28. Pfahnl Andreas C. ; Lienhard ; V John H. ; Watson Daniel J., Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly.
  29. French, F. William; Gilden, Sheldon Joel; Nigro, Jr., Arthur R., Method and system for providing cooling of components in a data storage system.
  30. Hein, Christopher Luke, Method for accelerated degradation of thermoplastics.
  31. Hein, Christopher Luke, Method for determining degradation of thermoplastics.
  32. Pfahnl, Andreas C.; Dunn, Jr., John J., Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques.
  33. Pfahnl, Andreas C.; Moore, John D., Semiconductor handler for rapid testing.
  34. Kim, Jae Choon; Kim, Jichul; Bae, Jin-Kwon; Jung, Eunho, Semiconductor package and method of estimating surface temperature of semiconductor device including the same.
  35. Gower Roger ; Kingery John ; Guthrie J. Cameron ; Frost Kevin ; Miller Steve ; Uekert Ken, Semiconductor thermal conditioning apparatus and method.
  36. Criniti Joseph ; Larranaga Javier I. ; Kim Edward E. ; Santos Esteban ; Vicente Nathaniel B., Semiconductor thermal protection arrangement.
  37. Evans, Nigel; Hewlett, Bill, Super cooler for a heat producing device.
  38. Evans, Nigel; Hewlett, William E., Super cooler for a heat producing device.
  39. Evans, Nigel; Hewlett, William E., Super cooler for a heat producing device.
  40. Evans,Nigel; Hewlett,William E., Super cooler for a heat producing device.
  41. Evans,Nigel; Hewlett,William E., Super cooler for a heat producing device.
  42. Nigel Evans GB; William E. Hewlett GB, Super cooler for a heat producing device.
  43. Bell, Lon E.; LaGrandeur, John, System and method for climate control within a passenger compartment of a vehicle.
  44. Bell, Lon E.; LaGrandeur, John, System and method for distributed thermoelectric heating and cooling.
  45. Yip,Tsunwai Gary; Nguyen,David, System for controlling the temperature of electronic devices.
  46. Pippin, Jack D., Temperature averaging thermal sensor apparatus and method.
  47. Goenka, Lakhi Nandlal, Temperature control system with thermoelectric device.
  48. Goenka, Lakhi Nandlal, Temperature control system with thermoelectric device.
  49. Barnhart, Todd Robert; Ranalli, Marco; Adldinger, Martin, Temperature control systems with thermoelectric devices.
  50. Ranalli, Marco; Adldinger, Martin; Barnhart, Todd Robert; LaGrandeur, John; Bell, Lon E.; Goenka, Lakhi Nandlal, Temperature control systems with thermoelectric devices.
  51. Pippin, Jack D., Temperature-based clock frequency controller apparatus and method.
  52. Pippin, Jack D., Temperature-based cooling device controller apparatus and method.
  53. Stone, William M., Temperature-controlled thermal platform for automated testing.
  54. Stone, William M., Temperature-controlled thermal platform for automated testing.
  55. Murakami, Toru; Mineo, Hiroyuki; Yoo, Ju Hwan, Test section unit, test head and electronic device testing apparatus.
  56. Goenka,Lakhi N.; Crane,Douglas T.; Bell,Lon E., Thermoelectric based heating and cooling system for a hybrid-electric vehicle.
  57. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
  58. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
  59. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  60. Zelissen, Marcus Jozef Gertrudis, Thermoelectric heat transferring system.
  61. Goenka, Lakhi Nandlal, Thermoelectric-based air conditioning system.
  62. Bell, Lon E.; LaGrandeur, John; Davis, Stephen, Thermoelectric-based battery thermal management system.
  63. Goenka, Lakhi N.; Crane, Douglas T.; Bell, Lon E., Thermoelectric-based heating and cooling system.
  64. Goenka, Lakhi N.; Crane, Douglas T.; Bell, Lon E., Thermoelectric-based heating and cooling system.
  65. Kossakovski, Dmitri; Barnhart, Todd Robert; Piggott, Alfred, Thermoelectric-based thermal management of electrical devices.
  66. Goenka, Lakhi Nandlal, Thermoelectric-based thermal management system.
  67. Johnson, Brad, Vortex unit for providing a desired environment for a semiconductor process.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로