초록 ▼

A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The matrix material may be an insulating

A thermal heat transfer member is disclosed for use with electronic or microwave systems. The thermal heat transfer member comprises a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The matrix material may be an insulating epoxy or thermoplastic resin, while the fibers are elongated continuous commonly directed graphite fibers. The fiber ends terminate at a thermal contact surface which is interfaced with a heat sink. The thermal contact surface may be the transverse edge of the planar member or can be substantially parallel to the planar member. The fiber ends are inclined at an angle with respect to the plane of the planar member to provide for termination of the fibers at the thermal contact surface parallel to the planar member. Heat into the composite member is transferable along the commonly directed graphite fibers.

대표청구항 ▼

A printed circuit board assembly comprising a thermal plane heat transfer member sandwiched between an opposed pair of printed circuit boards upon which heat generating electronic components are adapted to be mounted and wherein the thermal heat transfer member extends beyond at least one peripheral

A printed circuit board assembly comprising a thermal plane heat transfer member sandwiched between an opposed pair of printed circuit boards upon which heat generating electronic components are adapted to be mounted and wherein the thermal heat transfer member extends beyond at least one peripheral edge of the pair of printed circuit boards, and wherein the thermal plane heat transfer member comprises a generally planar composite member in which elongated conductive graphite fibers are disposed within a matrix material, the composite member having a pair of opposing planar outer surfaces substantially parallel with each other and a central heat flux conducting portion between the pair of planar outer surfaces, the opposed pair of circuit boards being secured to the pair of opposed planar outer surfaces, and wherein the fibers are oriented predominantly in a common direction within the planar composite member, and wherein at least at one end the fibers are inclined at an angle with respect to the plane of the composite member such that the fiber ends terminate at a peripheral thermal contact surface of the composite member, which thermal contact surface is substantially parallel to a surface of the substantially planar composite member, whereby heat flux into the central heat flux conducting portion of the composite member from the heat generating electronic components on the pair of circuit boards is transferable along the commonly directed fibers and is efficiently transferable from the member through fiber ends at the thermal contact surface.