A compact electronic housing for a satellite earth station is described. The compact electronic housing comprises a first compartment and a second compartment separated by a panel common to both compartments. The first compartment contains electronic components and is atmospherically isolated from o
A compact electronic housing for a satellite earth station is described. The compact electronic housing comprises a first compartment and a second compartment separated by a panel common to both compartments. The first compartment contains electronic components and is atmospherically isolated from outside air and the second compartment. The electronic components comprise a plurality of groupings. The second compartment provides for movement of outside air into the second compartment through a bottom opening and out a top opening by a chimney effect cooling a plurality of heat exchangers. The panel dividing the two compartments comprises a plurality of conductive heat transferring elements for transferring heat from the electronic components to the plurality of heat exchanger element. The plurality of conductive heat transferring elements are thermally insulated from each other by an insulating material; thereby, maintaining a temperature differential between the groups of electronic components even though there is a close physical proximity between the groups. The electronic components are connected to one side of the conductive heat transferring elements and the heat exchanger elements are connected to the other side of the conductive heat transferring elements. The electronic components having the greatest heat generating capacity and/or highest allowable operating temperature are physically separated and/or located above the other electronic components.
대표청구항▼
A compact electronic housing for a satellite earth station comprising a first compartment and a second compartment separated by a panel common to said first compartment and said second compartment; said first compartment being atmospherically isolated from outside air and said second compartment, sa
A compact electronic housing for a satellite earth station comprising a first compartment and a second compartment separated by a panel common to said first compartment and said second compartment; said first compartment being atmospherically isolated from outside air and said second compartment, said first compartment having a top inside surface and an access means for accessing electronic components contained therein; said electronic components comprising a first group of electronic components, a second group of electronic components, a third group of electronic components, and a fourth group of electronic components; said first group of electronic components generating more heat and/or tolerating a higher maximum operating temperature than said second group of electronic components, said third group of electronic components, and said fourth group of electronic components, said first group of electronic components being located above said second group of electronic components and said third group of electronic components; said third group of electronic components generating less heat and/or tolerating a lower maximum operating temperature than said first group of electronic components and said second group of electronic components, said third group of electronic components being located below said first group of electronic components, said second group of electronic components, and said fourth group of electronic components; said fourth group of electronic components having a lower maximum operating temperature than said first, second, and third groups of electronic components; said second compartment containing a plurality of heat exchanger means for transferring heat from said electronic components to said outside air, said plurality of heat exchanger means comprising a first heat exchanger means, a second heat exchanger means, a third heat exchanger means, and a fifth heat exchanger means; said second compartment having a bottom opening and a top opening to provide for movement of outside air causing a chimney effect within said second compartment, said outside air entering said second compartment through said bottom opening, contacting and cooling said plurality of heat exchanger means and exiting said second compartment through said top opening; said panel comprising a first, second , and third conductive heat transferring means for transferring heat from said electronic components and a fourth conductive heat transferring means for transferring heat from a fourth heat exchanger means contained in said first compartment to said plurality of heat exchanger means contained in said second compartment, said first, second, third, and fourth conductive heat transferring means each having a first side and a second side; said first group of electronic components being connected to said first side of said first conductive heat transferring means and said first, heat exchanger means being connected to said second side of said first conductive heat transferring means opposite said first group of electronic components, said second group of electronic components being connected to said first side of said second conductive heat transferring means and said second heat exchanger means being connected to said second side of said second conductive heat transferring means opposite said second group of electronic components, said third group of electronic components being connected to said first side of said third conductive heat transferring means and said third heat exchanger means being connected to said second side of said third conductive heat transferring means opposite said third group of electronic components, said fourth group of electronic components being connected to said top inside surface of said first compartment and being isolated from said first conductive heat transferring means; said first conductive heat transferring means being adjacent to and above said second conductive heat transferring means, said second conductive heat transferring means being insulated by an insulating material from said first conductive heat transferring means having said first group of electronic components being connected thereto, said second conductive heat transferring means being adjacent to and above said third conductive heat transferring means, said third conductive heat transferring means being insulated by an insulating material from said second conductive heat transferring means having said second group of electronic components being connected thereto, said third conductive heat transferring means being adjacent to and above said fourth conductive heat transferring means, said fourth conductive heat transferring means being insulated by an insulating material from said third conductive heat transferring means having said third group of electronic components being connected thereto; and said first compartment containing an air moving means for removing convective heat generated by said groups of electronic components, said air moving means being adapted to conveying air by recycling said air within said first compartment by contacting said air to said fourth heat exchanger means connected to said first side of said fourth conductive heat transferring means, cooling said air, conveying said air after contacting said fourth heat exchanger means to said fourth group of electronic components, to said first group of electronic components, to said second group of electronic components, to said third group of electronic components, and back to said air moving means.
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이 특허에 인용된 특허 (3)
Seki Hideki (Saijo JA), Chassis device having vented base and radiation member for supporting heat sources.
Bell, Lon E.; LaGrandeur, John; Davis, Stephen, Battery thermal management system including thermoelectric assemblies in thermal communication with a battery.
Aakalu Nandakumar G. ; Cho Gihyun ; Costa Richard Sander ; Massa Peter J. ; Picot Walter J. ; Plaza Daniel, Heat dissipating structure for an electrical assembly.
Schultz, Ronald E.; Hall, Kenwood H.; Herbert, Patrick C.; Bodmann, Douglas R.; Killian, Daniel E., Thermal cooling of industrial electronic module by conductive structure.
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