초록 ▼

This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the con

This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

대표청구항 ▼

In an interconnection board comprising a substrate, a plurality of points spaced apart on a surface of the substrate each defining a terminal point, a plurality of thin, elongated, preformed conductors, at least one of the conductors having an insulating layer extending along its length, means adher

In an interconnection board comprising a substrate, a plurality of points spaced apart on a surface of the substrate each defining a terminal point, a plurality of thin, elongated, preformed conductors, at least one of the conductors having an insulating layer extending along its length, means adhering the conductors to the surface of the substrate and in fixed position relative to each other and to said terminal points, said adhering means adhering the at least one insulated conductor to the surface of the substrate, the improvement which comprises: said adhering means which comprises an adhesive coating encapsulating the at least one insulated conductor, said adhesive coating prior to curing being non-tacky and non-blocking, being capable of being activated by application of energy and rapidly reverting to a solid non-tacky condition within about 0 to about 200 milliseconds after activation, said adhesive coating being bonded to the surface of the substrate at points of contact between the surface and the at least one conductor and in the vicinity of said points of contact. An article of manufacture comprising an interconnection circuit board having an insulating base substrate having a plurality of points spaced apart on the substrate each defining a terminal point, said article produced by a process comprising: a. providing at least one conductor having an adhesive coating, the adhesive coating being non-tacky, non-blocking and flexible prior to curing and which can be activated by heat, radiant or ultrasonic energy or by a combination thereof said adhesive coating rapidly reverting to a solid non-tacky condition within about 0 to about 200 milliseconds after activation; b. activating a portion of the adhesive coating on the conductor prior to or simultaneously with scribing the activated portion to a surface of the substrate; c. scribing the activated portion of the conductor onto the surface from a first terminal point along a predetermined, precise and reproducible pattern to a second terminal point, thereby adhering the conductor to the surface by means of the adhesive coating; said rapid reversion of the coating permitting the scribing speed along a straight path to reach a potential speed of at least 120 inches per minute, simultaneously allowing the conductor pattern to retain dimensional stability. An article of manufacture comprising an interconnection circuit board having at least one conductor on a surface of the interconnection board in a first predetermined pattern between two points spaced apart on the surface each defining a terminal point on the connection board, said board modified by a process comprising: a. providing an elongated preformed conductor having an adhesive coating, the adhesive coating being non-tacky, non-blocking and flexible prior to curing and which can be activated by thermal, radiant or ultrasonic energy or a combination thereof, said adhesive coating capable of rapidly reverting to a solid non-tacky condition within about 0 to about 200 milliseconds after activation: b. activating a portion of the adhesive coating the elongated preformed conductor prior to or simultaneously with scribing the activated portion to the surface; and c. scribing the activated portion of the elongated preformed conductor onto the surface from a first terminal point along a second predetermined, precise and reproducible pattern to a second terminal point, thereby adhering the elongated preformed conductor to the surface by means of the adhesive coating; said rapid reversion of the coating permitting the scribing speed along a straight path to reach a potential speed of at least 120 inches per minute, simultaneously along the second predetermined pattern to retain dimensional stability.