초록 ▼

A family of circuit boards are molded, each board having its own unique pattern of recessed circuit paths and component insertion through-holes. A different mold is provided for each different member of the family. The two cavity blocks of each mold cavity contain only the holes that are necessary t

A family of circuit boards are molded, each board having its own unique pattern of recessed circuit paths and component insertion through-holes. A different mold is provided for each different member of the family. The two cavity blocks of each mold cavity contain only the holes that are necessary to define the through-hole pattern for that member of the family. A plurality of core pins or wires are provided at the molding site. Only the core pins that are required by the mold in use at the molding site are rendered operative. Features of the method and apparatus, in addition to this core pin insertion feature, include (1) the molding site includes a base member that is usable with all molds of the family, and has means for injecting molding material and means for ejecting a finished circuit board, the injection means and the ejecting means being located in the board\s scrap edge area, (2) a hot runner injection system, (3) the mold cavity is placed under a partial vacuum prior to injection, (4) a semiconductor device is selectively used to rapidly heat or cool the mold, and (5) robot means, air and vacuum aids in ejection of a circuit board.

대표청구항 ▼

A method of molding a selected one of a family of circuit boards, wherein the plural circuit boards of the family include through-holes that are arranged in different physical patterns, the method comprising; providing a plurality of different cavity block pairs, one pair for each of said plural dif

A method of molding a selected one of a family of circuit boards, wherein the plural circuit boards of the family include through-holes that are arranged in different physical patterns, the method comprising; providing a plurality of different cavity block pairs, one pair for each of said plural different-pattern circuit boards, the cavity blocks of each of said pairs of cavity blocks having through-holes arranged in the pattern of the through-holes to be molded into its circuit board, providing a molding site that will accommodate any one of said cavity block pairs and whereat said one of said family of cavity block pairs may be mounted, providing a plurality of mold penetrating core pin means at said molding site, said core pin means being sufficient in number, and being located in a pattern so as to cooperate with the through-holes of all cavity block pairs of said family, placing said one cavity block pair at said molding site, moving only the core pin means corresponding to those required by said one cavity block pair, so as to penetrate the through-holes of said one cavity block pair, filling a circuit board cavity within said one cavity block pair with a molding material, opening said one cavity block pair, and removing a molded circuit board from the cavity in said one cavity block pair.