초록 ▼

A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving

A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion. The chip carrier has electrical leads soldered to the circuit board whereby thermal cycling of the circuit board structure does not substantially stress the bond between the solder, leads and circuit board.

대표청구항 ▼

A circuit board structure, comprising: circuit board means having a first coefficient of thermal expansion of at least about 160×10-7 in/in/°C., said circuit board means comprising: a first wrought metal component comprising a thin wrought foil having a first electrical circuit pattern thereon; a se

A circuit board structure, comprising: circuit board means having a first coefficient of thermal expansion of at least about 160×10-7 in/in/°C., said circuit board means comprising: a first wrought metal component comprising a thin wrought foil having a first electrical circuit pattern thereon; a second wrought metal component; said first and second wrought metal components being selected from the group consisting of copper and copper base alloys; a first bonding means having a second coefficient of thermal expansion of at least about 160×10-7 in/in/°C. bonding said first component to said second component whereby thermal stress generated by thermal cycling is substantially reduced within said circuit board means; chip carrier means having a third coefficient of thermal expansion being closely matched to the first and second coefficients of thermal expansion; means affixing said chip carrier means to said first electrical circuit pattern on said thin wrought foil whereby thermal cycling of said circuit board structure does not substantially stress the connection between said chip carrier means and said circuit board means.