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In apparatus for transporting semiconductor wafers, a spatula contains a single major recess for receiving a wafer. Adjacent one edge of the recess is a shoulder for locating the wafer in the sequence of operations for loading the spatula. As a result of the sequence, the center of the wafer is held

In apparatus for transporting semiconductor wafers, a spatula contains a single major recess for receiving a wafer. Adjacent one edge of the recess is a shoulder for locating the wafer in the sequence of operations for loading the spatula. As a result of the sequence, the center of the wafer is held at a predetermined, known location.

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A method for accurately locating a wafer on a cantilever mounted spatula for transporting said wafer, said wafer resting in a horizontal position on a support and said spatula having an upwardly facing recess and a ridge forming a stepped shoulder on the outer edge of said recess, said method compri

A method for accurately locating a wafer on a cantilever mounted spatula for transporting said wafer, said wafer resting in a horizontal position on a support and said spatula having an upwardly facing recess and a ridge forming a stepped shoulder on the outer edge of said recess, said method comprising the steps of: placing said spatula underneath said wafer; moving said spatula in a first direction to engage said wafer with said ridge; moving said spatula in a second direction, opposite to said first direction, to contact said wafer with the inner edge of said recess; raising said spatula to seat said wafer in said recess; and moving said spatula, with said wafer, in said first direction to remove said wafer from said support.