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Lapping slurry compositions with improved lap rate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-003/00
출원번호 US-0242231 (1988-09-09)
발명자 / 주소
  • Payne Charles C. (Aurora IL)
출원인 / 주소
  • Nalco Chemical Company (Naperville IL 02)
인용정보 피인용 횟수 : 44  인용 특허 : 4

초록 ▼

A concentrated lapping composition having the following makeup: ________________________________ - Ingredient % by Weight ________________________________ Finely divided inorganic 5-70 abrasive Carboxylic acid dispersant 0.1-1 polymer having a molecular weight of from 500-50,000 Lubricant 0.5-29 ___

대표청구항 ▼

A concentrated lapping composition having the following makeup: ________________________________ - Ingredient % by Weight ________________________________ Finely divided inorganic 5-70 abrasive Carboxylic acid dispersant 0.1-1 polymer having a molecular weight of from 500-50,000 Lubricant 0.5-29 ___

이 특허에 인용된 특허 (4)

  1. Chasman Jonathan N. (Shoreview MN) Hegel Ramon F. (St. Paul MN) Kendall Philip E. (Woodbury MN) Postma Nathan B. (White Bear Lake MN) Spencer Douglas S. (St. Paul MN), Coated abrasive suitable for use as a lapping material.
    상세보기
  2. Glemza Rimantas (Baltimore MD), Compositions for polishing silicon and germanium.
    상세보기
  3. Regler Dieter (Burghausen DEX) Moritz Alfred (Burghausen DEX), Lap cutting abrasive.
    상세보기
  4. Senda Tetsuji (Aichi JPX) Baba Takashi (Aichi JPX), Process for polishing surface of memory hard disc.
    상세보기

이 특허를 인용한 특허 (44)

  1. Kutsch V. Kim, Abrasive dental composition and method for use.
    상세보기
  2. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C., Additives to CMP slurry to polish dielectric films.
    상세보기
  3. Carter, Phillip; Bogush, Gregory H.; De Rege, Francesco M.; Chamberlain, Jeffrey P.; Schroeder, David J.; Mueller, Brian L., Alkali metal-containing polishing system and method.
    상세보기
  4. Cherian, Isaac K.; Carter, Phillip; Chamberlain, Jeffrey P.; Moeggenborg, Kevin; Boldridge, David W., Anionic abrasive particles treated with positively charged polyelectrolytes for CMP.
    상세보기
  5. Cherian,Isaac K; Carter,Phillip; Chamberlain,Jeffrey P.; Moeggenborg,Kevin; Boldridge,David W., Anionic abrasive particles treated with positively charged polyelectrolytes for CMP.
    상세보기
  6. Hattori, Masayuki; Ando, Michiaki; Nishimoto, Kazuo; Kawahashi, Nobuo, Aqueous dispersion for chemical mechanical polishing.
    상세보기
  7. Schroeder, David J.; Moeggenborg, Kevin J.; Chou, Homer; Chamberlain, Jeffrey P.; Hawkins, Joseph D.; Carter, Phillip, CMP method utilizing amphiphilic nonionic surfactants.
    상세보기
  8. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C., CMP slurry for planarizing metals.
    상세보기
  9. Yuchun Wang ; Rajeev Bajaj ; Fred C. Redeker, CMP slurry for planarizing metals.
    상세보기
  10. Rayo Mayoral, Patricia; Ancheyta Juárez, Jorge; Ramírez Solis, Jorge Fernando; Maity, Samir Kumar; Rana, Mohan Singh; Alonso Martínez, Fernando, Catalyst, its preparation and use for hydrodesulfurization of residua and heavy crudes.
    상세보기
  11. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C.; Li, Shijian, Chemical mechanical polishing composition and process.
    상세보기
  12. Steckenrider, J. Scott; Mueller, Brian L., Chemical mechanical polishing slurry and method for using same.
    상세보기
  13. Lin Chienting ; Wang Juin-Fang ; Jamin Fen Fen ; Ramachandran Ravikumar, Composition and method for reducing dishing in patterned metal during CMP process.
    상세보기
  14. Grover Gautam S. ; Mueller Brian L., Composition for oxide CMP.
    상세보기
  15. Grover, Gautam S.; Mueller, Brian L.; Wang, Shumin, Composition for oxide CMP.
    상세보기
  16. Carter, Phillip; Bogush, Gregory H; Khan, Farhana; Johns, Timothy P; Vacassy, Robert, Compositions and methods for dielectric CMP.
    상세보기
  17. Grover,Gautam S.; Mueller,Brian L.; Wang,Shumin, Compositions for oxide CMP.
    상세보기
  18. Sun,Lizhong; Li,Shijian; Redeker,Fred C., Cu CMP polishing pad cleaning.
    상세보기
  19. O'Reilly, Kirk T.; Moir, Michael E.; O'Rear, Dennis J., Deactivatable biocides for hydrocarbonaceous products.
    상세보기
  20. O'Reilly, Kirk T.; Moir, Michael E.; O'Rear, Dennis J.; Buetzow, Mark R.; Dorsch, Brian V., Deactivatable biocides in ballast water.
    상세보기
  21. Wang,You; Tsai,Stan D.; Karuppiah,Lakshmanan; Diao,Jie; Jia,Renhe; Yilmaz,Alpay, Electrochemical method for Ecmp polishing pad conditioning.
    상세보기
  22. Sun, Lizhong; Li, Shijian, Electrochemically assisted chemical polish.
    상세보기
  23. Hunt,William J.; Kendall,Philip E.; Dahlke,Gregg D., Formulations for coated diamond abrasive slurries.
    상세보기
  24. O'Reilly, Kirk T.; Moir, Michael E.; O'Rear, Dennis J., Inhibition of biological degradation in fischer-tropsch products.
    상세보기
  25. O'Reilly, Kirk T.; Moir, Michael E.; O'Rear, Dennis J., Inhibition of biological degradation of Fischer-Tropsch products.
    상세보기
  26. Wang, Yuchun; Tsai, Stan D.; Wijekoon, Kapila; Bajaj, Rajeev; Redeker, Fred C., Ion exchange materials for chemical mechanical polishing.
    상세보기
  27. Ji, Shuang, Lapping slurry having a cationic surfactant.
    상세보기
  28. Ko,Sen Hou; Song,Kevin H., Low cost and low dishing slurry for polysilicon CMP.
    상세보기
  29. Wang,Yan; Tsai,Stan D.; Hu,Yongqi; Liu,Feng Q.; Chen,Liang Yuh; Mao,Daxin; Tran,Huyen Karen; Wohlert,Martin S.; Jia,Renhe; Tian,Yuan A., Method and apparatus for reduced wear polishing pad conditioning.
    상세보기
  30. Sun,Lizhong; Tsai,Stan; Li,Shijian, Method and composition for the removal of residual materials during substrate planarization.
    상세보기
  31. Tsai, Stan; Sun, Lizhong; Li, Shijian, Method and composition for the selective removal of residual materials and barrier materials during substrate planarization.
    상세보기
  32. Lizhong Sun ; Shijian Li ; Fritz Redeker, Method for abrasive-free metal CMP in passivation domain.
    상세보기
  33. Schroeder, David J.; Carter, Phillip; Chamberlain, Jeffrey P.; Miller, Kyle; Cherian, Isaac K., Method for copper CMP using polymeric complexing agents.
    상세보기
  34. Yau, Wai-Fan; Cheung, David; Chopra, Nasreen Gazala; Lu, Yung-Cheng; Mandal, Robert; Moghadam, Farhad, Method of improving moisture resistance of low dielectric constant films.
    상세보기
  35. Carter, Phillip W.; Johns, Timothy P., Method of polishing a silicon-containing dielectric.
    상세보기
  36. Hsu, Wei-Yung; Prabhu, Gopalakrishna B.; Sun, Lizhong; Carl, Daniel A., Methods and compositions for chemical mechanical polishing.
    상세보기
  37. Small,Robert J.; Frey,Donald William; Tredinnick,Bruce; Hayden,Christopher G., Particulate or particle-bound chelating agents.
    상세보기
  38. Ramin Emami ; Shijian Li ; Sen-Hou Ko ; Fred C. Redeker ; Madhavi Chandrachood, Planarized Cu cleaning for reduced defects.
    상세보기
  39. Emami,Ramin; Li,Shijian; Ko,Sen Hou; Redeker,Fred C.; Chandrachood,Madhavi, Planarized copper cleaning for reduced defects.
    상세보기
  40. Kodate, Tadao, Plastic soft composition for polishing and for surface protective material application.
    상세보기
  41. Bunyan,Michael H.; Clement,Thomas A.; Hannafin,John J.; LaRosee,Marc E.; Young,Kent M., Polishing article for electro-chemical mechanical polishing.
    상세보기
  42. Luo, Qiuliang; Ye, Qianqiu; Block, Kelly H., Polishing of semiconductor substrates.
    상세보기
  43. Sun, Lizhong; Tsai, Stan D; Li, Shijian; White, John M, Solution to metal re-deposition during substrate planarization.
    상세보기
  44. O'Rear,Dennis J., Use of waste nitrogen from air separation units for blanketing cargo and ballast tanks.
    상세보기

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