초록 ▼

The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit

The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit this layer include mechanically adhering the layer to the substrate then removing portions of it to form a pattern. They also include printing adhesive on the substrate and using it to peel a conductive pattern off of the surface of a transfer agent. After depositing the first conductive pattern, the process prints an insulating layer on top of it. The insulating layer has openings through which the next conductive pattern makes electrical contact with the first. Similarly, the process places other conductive layers and prints other insulating layers between them to produce multiple layers of conductive patterns. The multilayer circuit board provided includes a substrate. It also includes conductive layers separated by insulating layers and electrically interconnected through openings in those insulating layers.

대표청구항 ▼

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer from said transf

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer from said transfer agent to leave a desired remaining pattern of the conductive layer; (c) transferring said desired remaining pattern to a substrate to establish electrical current paths across said substrate; (d) applying an insulating separating layer of material on the pattern on said substrate; (e) repeating steps (a) and (b); and (f) transferring said desired remaining pattern resulting form step (e) to the resultant of step (d) to establish electrical current paths thereacross.