$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Thermally conductive materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-005/16
출원번호 US-0095295 (1987-09-10)
발명자 / 주소
  • Squitieri Vincent (Billerica MA)
출원인 / 주소
  • Chomerics, Inc. (Woburn MA 02)
인용정보 피인용 횟수 : 81  인용 특허 : 5

초록

A form stable thermally conductive urethane material comprising of a urethane resin, a urethane curing agent and one or more thermally conductive fillers. It is useful in transferring thermal energy, for example, from an electonic component to a heat sink. The thermally conductive urethane material

대표청구항

A thermally conductive laminate consisting essentially of a center support layer and a pair of outer layers on opposite sides of the center support layer; the center support layer being a material selected from the group consisting of glass fiber, plastic film and metal foil; the outer layers being

이 특허에 인용된 특허 (5)

  1. Rhoades John M. (Waynesboro VA) Montanino Patrick J. (Charlottesville VA), Arrangement for heat transfer between a heat source and a heat sink.
  2. Larson Ralph I. (North Reading MA), Graphite heat-sink mountings.
  3. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel ; Jr. Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
  4. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and means for conducting heat from electronic components and the like.
  5. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Mounting pad for solid-state devices.

이 특허를 인용한 특허 (81)

  1. Clere, Thomas M., Agglomerated hexagonal boron nitride powders, method of making, and uses thereof.
  2. Bunyan Michael H. ; Kalinoski John P. ; Lucia Russell T. ; Vilandre Paul R. ; Watchko George R. ; Shvartsman Rudolf I. ; Soron John E., Apparatus for forming a gasket.
  3. Leo, Kristian; Jupe, Michael; Sprafke, Peter; Muzic, Markus; Endres, Wolfgang, Assembly having a component enclosed by a housing, and device and method used in its manufacture.
  4. Leo, Kristian; Jupe, Michael; Sprafke, Peter; Muzic, Markus; Endres, Wolfgang, Assembly having a component enclosed by a housing, and device and method used in its manufacture.
  5. Leo,Kristian; Jupe,Michael; Sprafke,Peter; Muzic,Markus; Endres,Wolfgang, Assembly having a component enclosed by a housing, and device and method used in its manufacture.
  6. Pruss,Eugene A.; Clere,Thomas M., Boron nitride agglomerated powder.
  7. Pruss, Eugene A.; Clere, Thomas M., Boron nitride agglomerated powder and devices comprising the powder.
  8. Greenwood, Alfred W.; Bunyan, Michael H.; Young, Kent M.; Wright, Deanna J., Clean release, phase change thermal interface.
  9. Dean, Nancy F.; Emigh, Roger A.; Pinter, Michael R.; Smith, Charles; Knowles, Timothy R.; Ahmadi, Mani; Ellman, Brett M.; Seaman, Christopher L., Compliant fibrous thermal interface.
  10. Kevin Kwong-Tai Chung, Compressible thermally-conductive interface.
  11. de Sorgo Miksa, Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer hav.
  12. Mitchnick Mark ; Muhammed Mamoun,BEX, Conductive polymers containing zinc oxide particles as additives.
  13. Chung, Deborah Duen Ling, Conformable interface materials for improving thermal contacts.
  14. Bunyan Michael H. ; de Sorgo Miksa, Conformal thermal interface material for electronic components.
  15. Bunyan, Michael H.; deSorgo, Miksa, Conformal thermal interface material for electronic components.
  16. Chen, Hao A.; Judd, Richard; Rufus, Isaac B.; Shultz, Jeffrey R., Contrasting gloss surface coverings optionally containing dispersed wear-resistant particles and methods of making the same.
  17. Kalinoski John P., Corrosion-resistant, form-in-place EMI shielding gasket.
  18. Bunyan, Michael H.; Blazdell, Phillip, Dispensable cured resin.
  19. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.
  20. Smith, Charles; Chau, Michael M.; Emigh, Roger A.; Dean, Nancy F., Electronic device having fibrous interface.
  21. Lawton, Ernest L.; Rau, Robert B.; Puckett, Garry D., Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding.
  22. Buckley Theresa M., Flexible composite material with phase change thermal storage.
  23. Bunyan, Michael H.; Kalinoski, John P., Form-in place EMI gaskets.
  24. Bunyan Michael H. ; Kalinoski John P., Form-in-place EMI gaskets.
  25. Kalinoski John P. ; Bunyan Michael H., Form-in-place EMI gaskets.
  26. Kalinoski John P. ; Bunyan Michael H., Form-in-place EMI gaskets.
  27. Janssen, Robert H. C.; Koenen, Jacob; Van Vehmendahl, Franciscus, Heat transport assembly.
  28. Paquet Rene,BEX ; Vanlathem Eric,BEX, Heating elements and a process for their manufacture.
  29. Lai, Chung-Ping; Chang, Kuo-Hsin; Chen, Jia-Cing, Hexagonal boron nitride heat dissipation structure.
  30. Young Kent M., High dielectric strength thermal interface material.
  31. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J., High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them.
  32. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J.; Clere, Thomas M.; Pruss, Eugene A., High solids HBN slurry, HBN paste, spherical HBN powder, and methods of making and using them.
  33. Pujari, Vimal K.; Collins, William T.; Kutsch, Jeffrey J., High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them.
  34. Bunyan, Michael H., High temperature stable thermal interface material.
  35. Clere, Thomas M.; Labour?, S?verine M., Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof.
  36. Bruce E. Novich ; Kami Lammon-Hilinski ; Walter J. Robertson ; Xiang Wu ; Vedagiri Velpari ; Ernest L. Lawton ; William B. Rice, Impregnated glass fiber strands and products including the same.
  37. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
  38. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
  39. Mitchell,Jonathan E.; Bunyan,Michael H., Lightweight heat sink.
  40. Iruvanti, Sushumna; Kemink, Randall G.; Kumar, Rajneesh; Ostrander, Steven P.; Singh, Prabjit, Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package.
  41. Clere, Thomas M., Method for making high thermal diffusivity boron nitride powders.
  42. Clere,Thomas M., Method for making high thermal diffusivity boron nitride powders.
  43. Eby John M. ; Chen Hao A. ; Burns ; Jr. Alonzo M., Method of making a surface covering having a natural appearance.
  44. Zaderej, Victor; O'Connor, Kevin; Manlapaz, Charlie; Hagan, Timothy; Ramey, Samuel C., Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source.
  45. Eby,John M.; Chen,Hao A.; Burns, Jr.,Alonzo M., Methods to make a surface covering having a natural appearance.
  46. Jayaraman, Saikumar; Koning, Paul A.; Dani, Ashay, Phase change material containing fusible particles as thermally conductive filler.
  47. Jayaraman,Saikumar; Koning,Paul A.; Dani,Ashay, Phase change material containing fusible particles as thermally conductive filler.
  48. Buckley, Theresa M., Phase change material thermal capacitor clothing.
  49. Jayaraman, Saikumar; Koning, Paul A.; Dani, Ashay, Polymer matrices for polymer solder hybrid materials.
  50. Jayaraman, Saikumar; Koning, Paul A.; Dani, Ashay, Polymer matrices for polymer solder hybrid materials.
  51. Jayaraman, Saikumar; Koning, Paul A.; Dani, Ashay, Polymer matrices for polymer solder hybrid materials.
  52. Jayaraman,Saikumar; Koning,Paul A.; Dani,Ashay, Polymer matrices for polymer solder hybrid materials.
  53. Pruss, Eugene A.; Clere, Thomas M.; Randa, Stuart K., Polymer processing aid and method for processing polymers.
  54. Koning,Paul A.; Hua,Fay; Deppisch,Carl L., Polymer with solder pre-coated fillers for thermal interface materials.
  55. Obermeyer, Henry K.; Gilbert, Eric N.; Baker, Grant Quinn, Process of manufacturing fiber reinforced composite via selective infusion of resin and resin blocking substance.
  56. Lawton, Ernest L.; Rau, Robert, Resin compatible yarn binder and uses thereof.
  57. Rau,Robert B.; Lawton,Ernest L., Resin compatible yarn binder and uses thereof.
  58. Lundell, Timothy J.; Lundell, Thomas L., Sealed thermal interface component.
  59. Balian, Charles; Wojtowicz, Stephen G.; Bergerson, Steven E., Self-adhering thermal interface material.
  60. Maeda, Kenji; Takata, Takashi; Ochi, Takao; Naraoka, Hiroki; Kawabata, Takeshi; Arai, Yoshiyuki; Nonoyama, Shigeru; Homma, Hajime, Semiconductor device and method for fabricating the same.
  61. Maeda, Kenji; Takata, Takashi; Ochi, Takao; Naraoka, Hiroki; Kawabata, Takeshi; Arai, Yoshiyuki; Nonoyama, Shigeru; Homma, Hajime, Semiconductor device and method for fabricating the same.
  62. Maeda,Kenji; Takata,Takashi; Ochi,Takao; Naraoka,Hiroki; Kawabata,Takeshi; Arai,Yoshiyuki; Nonoyama,Shigeru; Homma,Hajime, Semiconductor device and method for fabricating the same.
  63. Nakatani, Seiichi; Handa, Hiroyuki, Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same.
  64. Nakatani, Seiichi; Handa, Hiroyuki, Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same.
  65. Chen Hao A. ; Rufus Isaac B., Surface coverings containing aluminum oxide.
  66. Chen, Hao A.; Rufus, Isaac B., Surface coverings containing aluminum oxide.
  67. Chen,Hao A.; Rufus,Isaac B., Surface coverings containing aluminum oxide.
  68. Eby John M. ; Chen Hao A. ; Burns ; Jr. Alonzo M., Surface coverings having a natural appearance and methods to make a surface covering having a natural appearance.
  69. Eby, John M.; Chen, Hao A.; Burns, Jr., Alonzo M., Surface coverings having a natural appearance and methods to make a surface covering having a natural appearance.
  70. Richason, Chad E.; Hellickson, Dean R.; Watson, Mark W.; Tuthill, Allen F., Systems and methods for passive thermal management using phase change material.
  71. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
  72. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
  73. Bergin, Jonathan M., Thermal interface material having a zone-coated release linear.
  74. Balian,Charles; Bergerson,Steven E.; Currier,Gregg C., Thermal interface material with low melting alloy.
  75. Bunyan, Michael H., Thermal management materials.
  76. Bunyan, Michael H.; Young, Kent M., Thermal management materials having a phase change dispersion.
  77. Watchko, George R.; Gagnon, Matthew T.; Liu, Peter W.; de Sorgo, Miksa; Rodriguez, Christian V.; Lionetta, William G.; Oppenheim, Scott M., Thermal-sprayed metallic conformal coatings used as heat spreaders.
  78. Kumar, Sundaram Nand; Sites, Gary; Patel, Bhavik, Thermally and electrically conductive interface.
  79. Kumar, Sundaram Nand; Sites, Gary; Patel, Bhavik, Thermally and electrically conductive interface.
  80. Kumar, Sundaram Nand; Sites, Gary Garvin; Patel, Bhavik, Thermally conductive interface.
  81. Bunyan,Michael H.; de Sorgo,Miksa, Thermally or electrically-conductive form-in-place gap filter.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로